.25MIC 3M676XW TPC DISC 22.5"
Obsolete3M (TC)
LAPPING FILM DIAMOND 0.25U 22.5"
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.25MIC 3M676XW TPC DISC 22.5"
Obsolete3M (TC)
LAPPING FILM DIAMOND 0.25U 22.5"
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | .25MIC 3M676XW TPC DISC 22.5" |
|---|---|
| Abrasive Material | Diamond |
| Applications | Fiber Optic Connector Polishing |
| Diameter [diameter] | 22.5 " |
| Diameter [diameter] | 571.5 mm |
| Micron Size | 0.25 µ |
| Type | Lapping Film |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
Description
General part information
3M676X Series
Lapping Film Diamond 0.25µ X 22.50" (571.50mm) Dia
Documents
Technical documentation and resources