Specification	18-350000-10-HT

Board Material	Polyimide (PI)
Board Thickness	0.062 in
Contact Finish - Mating	Tin
Contact Finish - Post	Tin-Lead
Contact Finish Thickness - Post	200 µin
Contact Material - Post	Brass
Convert From (Adapter End)	SOIC
Convert To (Adapter End) Size	0.3 in
Convert To (Adapter End) Type	DIP, Row Spacing
Material	FR4 Epoxy Glass
Mounting Type	Through Hole
Number of Pins	18 pins
Number of Positions	18
Package Accepted	SOIC
Pitch	0.05 in
Pitch - Mating	0.05 in
Pitch - Post	0.1 in
Proto Board Type	DIP
Termination	Solder
Termination Post Length	0.125 in

18-3500 Series

Part	Board Thickness	Material	Number of Positions	Package Accepted	Proto Board Type	Pitch	Size / Dimension Width	Size / Dimension Length	Contact Finish Thickness - Post	Termination Post Length	Contact Finish - Mating	Pitch - Mating	Convert From (Adapter End)	Board Material	Contact Finish - Post	Termination	Mounting Type	Convert To (Adapter End) Size	Convert To (Adapter End) Type	Number of Pins	Contact Material - Post	Pitch - Post
Aries Electronics 18-350000-11-RC	0.062 in	FR4 Epoxy Glass	18	SOIC	DIP SMD	0.05 in	0.45 in	1.8 in
Aries Electronics 18-350000-10-HT	0.062 in	FR4 Epoxy Glass	18	SOIC	DIP	0.05 in			200 µin	0.125 in	Tin	0.05 in	SOIC	Polyimide (PI)	Tin-Lead	Solder	Through Hole	0.3 in	DIP Row Spacing	18 pins	Brass	0.1 in
Aries Electronics 18-350000-11-RC-P	0.062 in	FR4 Epoxy Glass	18	SOIC	DIP SMD	0.05 in	0.45 in	1.8 in

Pricing

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