SH2102WNAMU03
ActiveRohm Semiconductor
650V 50A, FRD BARE DIE FOR IGBT MODULE
SH2102WNAMU03
ActiveRohm Semiconductor
650V 50A, FRD BARE DIE FOR IGBT MODULE
Description
General part information
SH2102WN Series
Application: Free WheelingFor sale of Bare Die, please contact the specifications in our sales office. Currently, we don't sell Bare Die on the internet distributors now.
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Generation Mechanism of Voltage Surge on Commutation Side (Basic)
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Notes for Temperature Measurement Using Thermocouples
Moisture Sensitivity Level
Impedance Characteristics of Bypass Capacitor
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Judgment Criteria of Thermal Evaluation
Part Explanation
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Estimation of switching losses in IGBTs operating with resistive load
How to Use LTspice® Models
Basics of Thermal Resistance and Heat Dissipation
Power Eco Family: Overview of ROHM's Power Semiconductor Lineup
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Precautions for Thermal Resistance of Insulation Sheet
What Is Thermal Design
Types and Features of Transistors
How to Use LTspice® Models: Tips for Improving Convergence
About Export Administration Regulations (EAR)
Importance of Probe Calibration When Measuring Power: Deskew
About Flammability of Materials
PCB Layout Thermal Design Guide
Anti-Whisker formation
Measurement Method and Usage of Thermal Resistance RthJC
Calculation of Power Dissipation in Switching Circuit
SH2102WN Data Sheet
Method for Monitoring Switching Waveform
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Compliance of the ELV directive
Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Two-Resistor Model for Thermal Simulation
What is a Thermal Model? (IGBT)
Precautions When Measuring the Rear of the Package with a Thermocouple
Notes for Calculating Power Consumption:Static Operation
4 Steps for Successful Thermal Designing of Power Devices