
RFN10BM6STL
ObsoleteRohm Semiconductor
DIODE GEN PURP 600V 10A TO252

RFN10BM6STL
ObsoleteRohm Semiconductor
DIODE GEN PURP 600V 10A TO252
Description
General part information
RFN10 Series
ROHM's fast recovery diodes are ultra high-speed, low VF, and suited for significant efficiency increase of switching power supply as well as reduction of switching loss.
Technical Specifications
Parameters and characteristics for this part
| Specification | RFN10BM6STL |
|---|---|
| Current - Average Rectified (Io) | 10 A |
| Current - Reverse Leakage | 10 µA |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction | 150 °C |
| Package / Case | SC-63, DPAK (2 Leads + Tab), TO-252-3 |
| Package Name | TO-252 |
| Reverse Recovery Time (trr) | 50 ns |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Standard |
| Voltage - DC Reverse (Vr) (Max) | 600 V |
| Voltage - Forward (Vf) (Max) | 1.55 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
About Export Regulations
About Flammability of Materials
Notes for Calculating Power Consumption:Static Operation
Explanation for Marking
How to Use LTspice® Models: Tips for Improving Convergence
ESD Data
Precautions When Measuring the Rear of the Package with a Thermocouple
Anti-Whisker formation - Diodes
Report of SVHC under REACH Regulation
Moisture Sensitivity Level - Diodes
Absolute Maximum Rating and Electrical Characteristics of Diodes
PCB Layout Thermal Design Guide
Basics of Thermal Resistance and Heat Dissipation
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Measurement Method and Usage of Thermal Resistance RthJC
Diode Types and Applications
Method for Monitoring Switching Waveform
Compliance of the RoHS directive
Impedance Characteristics of Bypass Capacitor
What Is Thermal Design
Reliability Test Result
How to Use LTspice® Models
Inner Structure
Two-Resistor Model for Thermal Simulation
Part Explanation
Power Loss and Thermal Design of Diodes
How to Select Rectifier Diodes
θ<sub>JA</sub> and Ψ<sub>JT</sub>
How to Create Symbols for PSpice Models
RFN10BM6S Data Sheet
Package Dimensions
Importance of Probe Calibration When Measuring Power: Deskew
List of Diode Package Thermal Resistance
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
Notes for Temperature Measurement Using Forward Voltage of PN Junction
How to Select Reverse Current Protection Diodes for LDO Regulators
Notes for Temperature Measurement Using Thermocouples
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Condition of Soldering / Land Pattern Reference
What is a Thermal Model? (Diode)
Judgment Criteria of Thermal Evaluation
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Taping Information
How to Use the Thermal Resistance and Thermal Characteristics Parameters