WBSF30FC120ALV

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WeEn Semiconductors Co., Ltd

WBSF30FC120AL/NAU000/NO MARK*CHI

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WeEn Semiconductors Co., Ltd

WBSF30FC120AL/NAU000/NO MARK*CHI

Technical Specifications

Parameters and characteristics for this part

Specification	WBSF30FC120ALV

Current - Average Rectified (Io)	30 A
Current - Reverse Leakage @ Vr	250 µA
Mounting Type	Surface Mount
Operating Temperature - Junction	175 °C
Package / Case	Die
Reverse Recovery Time (trr)	65 ns
Speed	200 mA, 500 ns
Supplier Device Package	Wafer
Technology	Standard
Voltage - DC Reverse (Vr) (Max) [Max]	1.2 kV
Voltage - Forward (Vf) (Max) @ If	3.5 V

Part	Mounting Type	Supplier Device Package	Technology	Current - Average Rectified (Io)	Current - Reverse Leakage @ Vr	Voltage - Forward (Vf) (Max) @ If	Operating Temperature - Junction	Reverse Recovery Time (trr)	Speed	Voltage - DC Reverse (Vr) (Max) [Max]	Package / Case
WeEn Semiconductors Co., Ltd WBSF30FC120ALV	Surface Mount	Wafer	Standard	30 A	250 µA	3.5 V	175 °C	65 ns	200 mA 500 ns	1.2 kV	Die

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	426	$ 0.93

General part information

Diode 1200 V 30A Surface Mount Wafer

Technical documentation and resources

No documents available