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IRF6643TRPBF - IRF6614TR1PBF

IRF6643TRPBF

Active
Infineon Technologies

POWER MOSFET, N CHANNEL, 150 V, 35 A, 0.0345 OHM, DIRECTFET MZ, SURFACE MOUNT

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IRF6643TRPBF - IRF6614TR1PBF

IRF6643TRPBF

Active
Infineon Technologies

POWER MOSFET, N CHANNEL, 150 V, 35 A, 0.0345 OHM, DIRECTFET MZ, SURFACE MOUNT

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationIRF6643TRPBF
Current - Continuous Drain (Id) @ 25°C35 A, 6.2 A
Drain to Source Voltage (Vdss)150 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs55 nC
Input Capacitance (Ciss) (Max) @ Vds2340 pF
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-40 °C
Package / CaseDirectFET™ Isometric MZ
Power Dissipation (Max)2.8 W, 89 W
Rds On (Max) @ Id, Vgs34.5 mOhm
Supplier Device PackageDIRECTFET™ MZ
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id [Max]4.9 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.79
10$ 1.81
100$ 1.25
500$ 1.00
1000$ 0.93
2000$ 0.86
Digi-Reel® 1$ 2.79
10$ 1.81
100$ 1.25
500$ 1.00
1000$ 0.93
2000$ 0.86
Tape & Reel (TR) 4800$ 0.86
NewarkEach (Supplied on Full Reel) 4800$ 1.06

Description

General part information

IRF6643 Series

IRF6643TRPBF is a digital audio MOSFET specifically designed for Class-D audio amplifier applications. This MOSFET utilizes the latest processing techniques to achieve low on-resistance per silicon area. Furthermore, gate charge, body-diode reverse recovery and internal gate resistance are optimized to improve key Class-D audio amplifier performance factors such as efficiency, THD, and EMI. The IRF6643PbF device utilizes DirectFET® packaging technology. DirectFET® packaging technology offers lower parasitic inductance and resistance when compared to conventional wire bonded SOIC packaging. Lower inductance improves EMI performance by reducing the voltage ringing that accompanies fast current transients. The DirectFET® package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing method and processes.