RB510SM-30T2R
ActiveRohm Semiconductor
SMALL SIGNAL SCHOTTKY DIODE, SINGLE, 30 V, 100 MA, 460 MV, 500 MA, 150 °C
RB510SM-30T2R
ActiveRohm Semiconductor
SMALL SIGNAL SCHOTTKY DIODE, SINGLE, 30 V, 100 MA, 460 MV, 500 MA, 150 °C
Description
General part information
RB510SM-30 Series
RB510SM-30 is low VFhigh reliability Schottky Barrier Diode, suitable for small current rectification.
Technical Specifications
Parameters and characteristics for this part
| Specification | RB510SM-30T2R |
|---|---|
| Current - Average Rectified (Io) | 100 mA |
| Current - Reverse Leakage | 300 nA |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction (Max) | 150 °C |
| Package / Case | SOD-523, SC-79 |
| Package Name | EMD2 |
| Speed | Any Speed, Small Signal |
| Speed - Fast Recovery (Maximum) | 200 mA |
| Speed - Small Signal Current Max | 200 mA, 200 mA, 200 mA |
| Technology | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 30 V |
| Voltage - Forward (Vf) (Max) | 460 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Power Loss and Thermal Design of Diodes
Importance of Probe Calibration When Measuring Power: Deskew
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Judgment Criteria of Thermal Evaluation
Notes for Temperature Measurement Using Forward Voltage of PN Junction
What Is Thermal Design
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Basics of Thermal Resistance and Heat Dissipation
Measurement Method and Usage of Thermal Resistance RthJC
Anti-Whisker formation - Diodes
Method for Monitoring Switching Waveform
How to Create Symbols for PSpice Models
Package Dimensions
Two-Resistor Model for Thermal Simulation
Diode Types and Applications
About Flammability of Materials
PCB Layout Thermal Design Guide
How to Select Rectifier Diodes
What is a Thermal Model? (Diode)
List of Diode Package Thermal Resistance
ESD Data
Diode Selection Method for Asynchronous Converter
Notes for Temperature Measurement Using Thermocouples
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Compliance of the RoHS directive
Explanation for Marking
Part Explanation
Impedance Characteristics of Bypass Capacitor
How to Use the Thermal Resistance and Thermal Characteristics Parameters
How to Select Reverse Current Protection Diodes for LDO Regulators
ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment
Taping Information
Absolute Maximum Rating and Electrical Characteristics of Diodes
How to Use LTspice® Models: Tips for Improving Convergence
Inner Structure
Condition of Soldering / Land Pattern Reference
How to Use LTspice® Models
Moisture Sensitivity Level - Diodes
Notes for Calculating Power Consumption:Static Operation
Reliability Test Result
Precautions When Measuring the Rear of the Package with a Thermocouple
Certificate of not containing SVHC under REACH Regulation
About Export Regulations