Specification	92-9574-7619

Composition Elements	Sn, Cu
Composition Formula	Sn99.3Cu0.7
Cu Composition	0.7 %
Diameter	0.025 in
Form	Spool
Form Weight	17.64 oz
Melting Point	441 °F
Process	Lead Free
Sn Composition	99.3 %
Storage/Refrigeration Temperature (Maximum)	104 °F
Storage/Refrigeration Temperature (Minimum)	50 °F
Type	Wire Solder
Wire Gauge	22 AWG, 23 SWG

92-9574 Series

Part	Diameter	Process	Form Weight	Form	Storage/Refrigeration Temperature (Minimum)	Storage/Refrigeration Temperature (Maximum)	Wire Gauge	Type	Sn Composition	Composition Formula	Composition Elements	Cu Composition	Melting Point
Kester Solder 92-9574-7618	0.031 in	Lead Free	17.64 oz	Spool	50 °F	104 °F	20 AWG 22 SWG	Wire Solder	99.3 %	Sn99.3Cu0.7	Cu Sn	0.7 %	441 °F
Kester Solder 92-9574-7601	0.031 in	Lead Free	1 lb	Spool	50 °F	104 °F	20 AWG 22 SWG	Wire Solder	99.3 %	Sn99.3Cu0.7	Cu Sn	0.7 %	441 °F
Kester Solder 92-9574-7619	0.025 in	Lead Free	17.64 oz	Spool	50 °F	104 °F	22 AWG 23 SWG	Wire Solder	99.3 %	Sn99.3Cu0.7	Cu Sn	0.7 %	441 °F
Kester Solder 92-9574-7650	0.047 in	Lead Free	17.64 oz	Spool	50 °F	104 °F	17 AWG 18 SWG	Wire Solder	99.3 %	Sn99.3Cu0.7	Cu Sn	0.7 %	441 °F

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