XR2T-2421-N

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Omron Electronics Inc-EMC Div

CONN IC DIP SOCKET 24POS GOLD

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XR2T-2421-N

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Omron Electronics Inc-EMC Div

CONN IC DIP SOCKET 24POS GOLD

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	XR2T-2421-N	XR2T Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Gold	Gold
Contact Finish Thickness - Mating	Flash	Flash
Contact Finish Thickness - Mating	-	10 - 29.5 Áin
Contact Finish Thickness - Mating	-	0.25 - 0.75 Ám
Contact Finish Thickness - Post	Flash	Flash
Contact Finish Thickness - Post	-	29.5 µin
Contact Finish Thickness - Post	-	0.25 - 0.75 µm
Contact Finish Thickness - Post	-	10 çin
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post	-	Beryllium Copper
Contact Material - Post [custom]	Brass	Brass
Contact Resistance	20 mOhm	20 mOhm
Current Rating (Amps)	1 A	1 A
Features	Open Frame	Seal Tape, Open Frame
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled	Polybutylene Terephthalate (PBT), Glass Filled
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Threaded	Through Hole, Threaded
Number of Positions or Pins (Grid)	24	20 - 24
Operating Temperature [Max]	125 °C	125 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch - Mating	0.1 in	0.1 in
Pitch - Mating	2.54 mm	2.54 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Solder	Solder
Termination Post Length [x]	0.138 in	0.138 in
Termination Post Length [x]	3.5 mm	3.5 mm
Type	0.4 in	0.3 - 0.4 "
Type	10.16 mm	7.62 - 10.16 mm
Type	DIP	DIP

XR2T Series

CONN IC DIP SOCKET 20POS GOLD

Part	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Mounting Type	Termination	Pitch - Post	Pitch - Post	Contact Resistance	Contact Material - Post	Pitch - Mating	Pitch - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Type	Type	Type	Contact Material - Mating	Features	Contact Finish - Mating	Housing Material	Current Rating (Amps)	Termination Post Length [x]	Termination Post Length [x]	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Post [custom]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Omron Electronics Inc-EMC Div XR2T-2021-N	Gold	20	Flash	Flash	Through Hole	Solder	2.54 mm	0.1 in	20 mOhm	Beryllium Copper	0.1 in	2.54 mm	-55 °C	125 °C	0.3 "	7.62 mm	DIP	Beryllium Copper	Open Frame, Seal Tape	Gold	Polybutylene Terephthalate (PBT), Glass Filled	1 A	0.138 in	3.5 mm	UL94 V-0
Omron Electronics Inc-EMC Div XR2T-2401-N	Gold	24			Threaded	Solder	2.54 mm	0.1 in	20 mOhm		0.1 in	2.54 mm	-55 °C	125 °C	0.4 in	10.16 mm	DIP	Beryllium Copper	Open Frame	Gold	Polybutylene Terephthalate (PBT), Glass Filled	1 A	0.138 in	3.5 mm	UL94 V-0	29.5 Áin	0.75 Ám	Brass	29.5 µin	0.75 µm
Omron Electronics Inc-EMC Div XR2T-2421-N	Gold	24	Flash	Flash	Threaded	Solder	2.54 mm	0.1 in	20 mOhm		0.1 in	2.54 mm	-55 °C	125 °C	0.4 in	10.16 mm	DIP	Beryllium Copper	Open Frame	Gold	Polybutylene Terephthalate (PBT), Glass Filled	1 A	0.138 in	3.5 mm	UL94 V-0			Brass
Omron Electronics Inc-EMC Div XR2T-2411-N	Gold	24			Threaded	Solder	2.54 mm	0.1 in	20 mOhm		0.1 in	2.54 mm	-55 °C	125 °C	0.4 in	10.16 mm	DIP	Beryllium Copper	Open Frame	Gold	Polybutylene Terephthalate (PBT), Glass Filled	1 A	0.138 in	3.5 mm	UL94 V-0	10 çin	0.25 çm	Brass		0.25 çm	10 çin

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	20	$ 6.72