XR2T-2021-N

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Omron Electronics Inc-EMC Div

CONN IC DIP SOCKET 20POS GOLD

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XR2T-2021-N

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Omron Electronics Inc-EMC Div

CONN IC DIP SOCKET 20POS GOLD

Deep-Dive with AI

DocumentsDatasheet How to Read Date Codes

Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	24	$ 5.05

Description

General part information

XR2T Series

20 (2 x 10) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources

Datasheet

How to Read Date Codes

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	XR2T-2021-N	XR2T Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Gold	Gold
Contact Finish Thickness - Mating	Flash	Flash
Contact Finish Thickness - Mating	-	10 - 29.5 Áin
Contact Finish Thickness - Mating	-	0.25 - 0.75 Ám
Contact Finish Thickness - Post	Flash	Flash
Contact Finish Thickness - Post	-	29.5 µin
Contact Finish Thickness - Post	-	0.25 - 0.75 µm
Contact Finish Thickness - Post	-	10 çin
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post	Beryllium Copper	Beryllium Copper
Contact Material - Post	-	Brass
Contact Resistance	20 mOhm	20 mOhm
Current Rating (Amps)	1 A	1 A
Features	Seal Tape, Open Frame	Seal Tape, Open Frame
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled	Polybutylene Terephthalate (PBT), Glass Filled
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole, Threaded
Number of Positions or Pins (Grid)	20	20 - 24
Operating Temperature [Max]	125 °C	125 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch - Mating	0.1 in	0.1 in
Pitch - Mating	2.54 mm	2.54 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Solder	Solder
Termination Post Length [x]	0.138 in	0.138 in
Termination Post Length [x]	3.5 mm	3.5 mm
Type	0.3 "	0.3 - 0.4 "
Type	7.62 mm	7.62 - 10.16 mm
Type	DIP	DIP

XR2T Series

CONN IC DIP SOCKET 20POS GOLD

Part	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Mounting Type	Termination	Pitch - Post	Pitch - Post	Contact Resistance	Contact Material - Post	Pitch - Mating	Pitch - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Type	Type	Type	Contact Material - Mating	Features	Contact Finish - Mating	Housing Material	Current Rating (Amps)	Termination Post Length [x]	Termination Post Length [x]	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Post [custom]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Omron Electronics Inc-EMC Div XR2T-2021-N	Gold	20	Flash	Flash	Through Hole	Solder	2.54 mm	0.1 in	20 mOhm	Beryllium Copper	0.1 in	2.54 mm	-55 °C	125 °C	0.3 "	7.62 mm	DIP	Beryllium Copper	Open Frame, Seal Tape	Gold	Polybutylene Terephthalate (PBT), Glass Filled	1 A	0.138 in	3.5 mm	UL94 V-0
Omron Electronics Inc-EMC Div XR2T-2401-N	Gold	24			Threaded	Solder	2.54 mm	0.1 in	20 mOhm		0.1 in	2.54 mm	-55 °C	125 °C	0.4 in	10.16 mm	DIP	Beryllium Copper	Open Frame	Gold	Polybutylene Terephthalate (PBT), Glass Filled	1 A	0.138 in	3.5 mm	UL94 V-0	29.5 Áin	0.75 Ám	Brass	29.5 µin	0.75 µm
Omron Electronics Inc-EMC Div XR2T-2421-N	Gold	24	Flash	Flash	Threaded	Solder	2.54 mm	0.1 in	20 mOhm		0.1 in	2.54 mm	-55 °C	125 °C	0.4 in	10.16 mm	DIP	Beryllium Copper	Open Frame	Gold	Polybutylene Terephthalate (PBT), Glass Filled	1 A	0.138 in	3.5 mm	UL94 V-0			Brass
Omron Electronics Inc-EMC Div XR2T-2411-N	Gold	24			Threaded	Solder	2.54 mm	0.1 in	20 mOhm		0.1 in	2.54 mm	-55 °C	125 °C	0.4 in	10.16 mm	DIP	Beryllium Copper	Open Frame	Gold	Polybutylene Terephthalate (PBT), Glass Filled	1 A	0.138 in	3.5 mm	UL94 V-0	10 çin	0.25 çm	Brass		0.25 çm	10 çin