RB228T100HZC9
ActiveRohm Semiconductor
SCHOTTKY BARRIER DIODE (AEC-Q101 QUALIFIED)
RB228T100HZC9
ActiveRohm Semiconductor
SCHOTTKY BARRIER DIODE (AEC-Q101 QUALIFIED)
Description
General part information
RB228T100HZ Series
RB228T100HZ is super low IRschottky barrier diode for switching power supply.
Technical Specifications
Parameters and characteristics for this part
| Specification | RB228T100HZC9 |
|---|---|
| Current - Average Rectified (Io) (per Diode) | 15 A |
| Current - Reverse Leakage | 5 µA |
| Diode Configuration | Common Cathode |
| Diode Pair Count | 1 pair |
| Grade | Automotive |
| Mounting Type | Through Hole |
| Operating Temperature - Junction | 150 °C |
| Package / Case | TO-220-3 Full Pack |
| Package Name | TO-220FN |
| Qualification | AEC-Q101 |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 100 V |
| Voltage - Forward (Vf) (Max) | 870 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
RB228T100HZC9 | Datasheet
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Notes for Calculating Power Consumption:Static Operation
PCB Layout Thermal Design Guide
Method for Monitoring Switching Waveform
Moisture Sensitivity Level - Diodes
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Anti-Whisker formation - Diodes
Importance of Probe Calibration When Measuring Power: Deskew
Constitution Materials List
Inner Structure
ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment
Part Explanation
Two-Resistor Model for Thermal Simulation
Package Dimensions
Certificate of not containing SVHC under REACH Regulation
Explanation for Marking
Condition of Soldering / Land Pattern Reference
Absolute Maximum Rating and Electrical Characteristics of Diodes
RB228T100HZ ESD Data
List of Diode Package Thermal Resistance
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Compliance of the RoHS directive
How to Use LTspice® Models: Tips for Improving Convergence
Reliability Test Result
About Flammability of Materials
Diode Selection Method for Asynchronous Converter
Judgment Criteria of Thermal Evaluation
Power Loss and Thermal Design of Diodes
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
How to Select Reverse Current Protection Diodes for LDO Regulators
Notes for Temperature Measurement Using Thermocouples
Impedance Characteristics of Bypass Capacitor
What is a Thermal Model? (Diode)
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
How to Use LTspice® Models
Diode Types and Applications
Basics of Thermal Resistance and Heat Dissipation
Notes for Temperature Measurement Using Forward Voltage of PN Junction
What Is Thermal Design
Taping Information
Measurement Method and Usage of Thermal Resistance RthJC
Precautions When Measuring the Rear of the Package with a Thermocouple
About Export Regulations
How to Select Rectifier Diodes
θ<sub>JC</sub> and Ψ<sub>JT</sub>