
BD82006FVJ-MGE2
ActiveRohm Semiconductor
2.4A CURRENT LIMIT HIGH SIDE SWITCH ICS

BD82006FVJ-MGE2
ActiveRohm Semiconductor
2.4A CURRENT LIMIT HIGH SIDE SWITCH ICS
Description
General part information
BD82006 Series
BD82006FVJ-M is the low on-resistance N-Channel MOSFET high-side power switch optimized for Universal Serial Bus (USB) applications. BD82006FVJ-M is equipped with the function of over-current protection, thermal shutdown, under-voltage lockout and soft-start.
Technical Specifications
Parameters and characteristics for this part
| Specification | BD82006FVJ-MGE2 |
|---|---|
| Current - Output (Max) | 3 A |
| Fault Protection | UVRO, Over Temperature, Current Limiting (Fixed) |
| Grade | Automotive |
| Input Ratio | 1 |
| Input Type | Non-Inverting |
| Interface | On/Off |
| Mounting Type | Surface Mount |
| Number of Outputs | 1 |
| Operating Temperature (Max) | 85 °C |
| Operating Temperature (Min) | -40 °C |
| Output Configuration | High Side |
| Output Ratio | 1 |
| Output Type | N-Channel |
| Package Length | 0.118 in |
| Package Name | 8-TSSOP-BJ, 8-TSSOP, 8-MSOP |
| Package Width | 3 mm |
| Qualification | AEC-Q100 |
| Rds On (Typ) | 70 mOhm |
| Switch Type | USB Switch |
| Voltage - Load (Max) | 5.5 V |
| Voltage - Load (Min) | 2.7 V |
| Voltage - Supply (Vcc/Vdd) | Not Required |
| Voltage - Supply (Vdd/Vcc) | Not Required |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Basics of Thermal Resistance and Heat Dissipation
Impedance Characteristics of Bypass Capacitor
Compliance with the ELV directive
Solder Joint Rate and Thermal Resistance of Exposed Pad
TSSOP-B8J Package Information
Anti-Whisker formation
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Thermal Resistance
θ<sub>JC</sub> and Ψ<sub>JT</sub>
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Factory Information
Judgment Criteria of Thermal Evaluation
Design Guide and Example of Stencil for Exposed Pad
What Is Thermal Design
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
UL94 Flame Classifications of Mold Compound
Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package
How to Use the Two-Resistor Model
PCB Layout Thermal Design Guide
Five Steps for Successful Thermal Design of IC
AEC-Q101 Automotive Requirements