W25X32VSSIG T&R
ActiveWinbond Electronics
IC FLASH 32MBIT SPI 75MHZ 8SOIC
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W25X32VSSIG T&R
ActiveWinbond Electronics
IC FLASH 32MBIT SPI 75MHZ 8SOIC
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | W25X32VSSIG T&R | W25X32 Series |
|---|---|---|
| Clock Frequency | 75 MHz | 75 MHz |
| Memory Format | FLASH | FLASH |
| Memory Interface | SPI | SPI |
| Memory Organization | 4M x 8 | 4M x 8 |
| Memory Size | 32 Gbit | 32 Gbit |
| Memory Type | Non-Volatile | Non-Volatile |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature [Max] | 85 °C | 85 °C |
| Operating Temperature [Min] | -40 °C | -40 °C |
| Package / Case | 8-SOIC | 16-SOIC, 8-WDFN Exposed Pad, 8-SOIC |
| Package / Case [x] | 0.209 " | 0.209 - 0.295 in |
| Package / Case [y] | 5.3 mm | 5.3 - 7.5 mm |
| Supplier Device Package | 8-SOIC | 16-SOIC, 8-WSON (8x6), 8-SOIC |
| Technology | FLASH | FLASH |
| Voltage - Supply [Max] | 3.6 V | 3.6 V |
| Voltage - Supply [Min] | 2.7 V | 2.7 V |
| Write Cycle Time - Word, Page | 3 ms | 3 ms |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
W25X32 Series
IC FLASH 32MBIT SPI 75MHZ 16SOIC
| Part | Package / Case [x] | Package / Case | Package / Case [y] | Memory Interface | Write Cycle Time - Word, Page | Technology | Memory Type | Clock Frequency | Memory Format | Memory Size | Operating Temperature [Max] | Operating Temperature [Min] | Voltage - Supply [Min] | Voltage - Supply [Max] | Supplier Device Package | Memory Organization | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics W25X32VSFIG | 0.295 in | 16-SOIC | 7.5 mm | SPI | 3 ms | FLASH | Non-Volatile | 75 MHz | FLASH | 32 Gbit | 85 °C | -40 °C | 2.7 V | 3.6 V | 16-SOIC | 4M x 8 | Surface Mount |
Winbond Electronics W25X32VZEIG | 8-WDFN Exposed Pad | SPI | 3 ms | FLASH | Non-Volatile | 75 MHz | FLASH | 32 Gbit | 85 °C | -40 °C | 2.7 V | 3.6 V | 8-WSON (8x6) | 4M x 8 | Surface Mount | ||
Winbond Electronics W25X32VSSIG | 0.209 " | 8-SOIC | 5.3 mm | SPI | 3 ms | FLASH | Non-Volatile | 75 MHz | FLASH | 32 Gbit | 85 °C | -40 °C | 2.7 V | 3.6 V | 8-SOIC | 4M x 8 | Surface Mount |
Winbond Electronics W25X32VZEIG T&R | 8-WDFN Exposed Pad | SPI | 3 ms | FLASH | Non-Volatile | 75 MHz | FLASH | 32 Gbit | 85 °C | -40 °C | 2.7 V | 3.6 V | 8-WSON (8x6) | 4M x 8 | Surface Mount | ||
Winbond Electronics W25X32VSSIG T&R | 0.209 " | 8-SOIC | 5.3 mm | SPI | 3 ms | FLASH | Non-Volatile | 75 MHz | FLASH | 32 Gbit | 85 °C | -40 °C | 2.7 V | 3.6 V | 8-SOIC | 4M x 8 | Surface Mount |
Winbond Electronics W25X32VSFIG T&R | 0.295 in | 16-SOIC | 7.5 mm | SPI | 3 ms | FLASH | Non-Volatile | 75 MHz | FLASH | 32 Gbit | 85 °C | -40 °C | 2.7 V | 3.6 V | 16-SOIC | 4M x 8 | Surface Mount |
Description
General part information
W25X32 Series
FLASH Memory IC 32Mbit SPI 75 MHz 8-SOIC
Documents
Technical documentation and resources