IC FLASH 32MBIT SPI 75MHZ 16SOIC
| Part | Package / Case [x] | Package / Case | Package / Case [y] | Memory Interface | Write Cycle Time - Word, Page | Technology | Memory Type | Clock Frequency | Memory Format | Memory Size | Operating Temperature [Max] | Operating Temperature [Min] | Voltage - Supply [Min] | Voltage - Supply [Max] | Supplier Device Package | Memory Organization | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics W25X32VSFIG | 0.295 in | 16-SOIC | 7.5 mm | SPI | 3 ms | FLASH | Non-Volatile | 75 MHz | FLASH | 32 Gbit | 85 °C | -40 °C | 2.7 V | 3.6 V | 16-SOIC | 4M x 8 | Surface Mount |
Winbond Electronics W25X32VZEIG | 8-WDFN Exposed Pad | SPI | 3 ms | FLASH | Non-Volatile | 75 MHz | FLASH | 32 Gbit | 85 °C | -40 °C | 2.7 V | 3.6 V | 8-WSON (8x6) | 4M x 8 | Surface Mount | ||
Winbond Electronics W25X32VSSIG | 0.209 " | 8-SOIC | 5.3 mm | SPI | 3 ms | FLASH | Non-Volatile | 75 MHz | FLASH | 32 Gbit | 85 °C | -40 °C | 2.7 V | 3.6 V | 8-SOIC | 4M x 8 | Surface Mount |
Winbond Electronics W25X32VZEIG T&R | 8-WDFN Exposed Pad | SPI | 3 ms | FLASH | Non-Volatile | 75 MHz | FLASH | 32 Gbit | 85 °C | -40 °C | 2.7 V | 3.6 V | 8-WSON (8x6) | 4M x 8 | Surface Mount | ||
Winbond Electronics W25X32VSSIG T&R | 0.209 " | 8-SOIC | 5.3 mm | SPI | 3 ms | FLASH | Non-Volatile | 75 MHz | FLASH | 32 Gbit | 85 °C | -40 °C | 2.7 V | 3.6 V | 8-SOIC | 4M x 8 | Surface Mount |
Winbond Electronics W25X32VSFIG T&R | 0.295 in | 16-SOIC | 7.5 mm | SPI | 3 ms | FLASH | Non-Volatile | 75 MHz | FLASH | 32 Gbit | 85 °C | -40 °C | 2.7 V | 3.6 V | 16-SOIC | 4M x 8 | Surface Mount |