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BGS12P2L6E6327XTSA1 - 6-XFDFN

BGS12P2L6E6327XTSA1

Active
Infineon Technologies

RF SWITCH, 0.05-6GHZ, 1.65V-3.4V, TSLP-6 ROHS COMPLIANT: YES

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Search across all available documentation for this part.

BGS12P2L6E6327XTSA1 - 6-XFDFN

BGS12P2L6E6327XTSA1

Active
Infineon Technologies

RF SWITCH, 0.05-6GHZ, 1.65V-3.4V, TSLP-6 ROHS COMPLIANT: YES

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationBGS12P2L6E6327XTSA1
CircuitSPDT
Frequency Range [Max]6 GHz
Frequency Range [Min]50 MHz
IIP374 dBm
Impedance50 Ohms
Insertion Loss0.51 dB
Mounting TypeSurface Mount
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Package / Case6-XFDFN
RF TypeGSM, LTE, W-CDMA
Supplier Device PackagePG-TSLP-6-4
Test Frequency5.925 GHz
Voltage - Supply [Max]3.4 V
Voltage - Supply [Min]1.65 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.41
10$ 0.36
25$ 0.33
100$ 0.29
250$ 0.25
500$ 0.22
1000$ 0.18
5000$ 0.16
Digi-Reel® 1$ 0.41
10$ 0.36
25$ 0.33
100$ 0.29
250$ 0.25
500$ 0.22
1000$ 0.18
5000$ 0.16
Tape & Reel (TR) 15000$ 0.15
30000$ 0.15
NewarkEach (Supplied on Cut Tape) 1$ 0.49
10$ 0.33
25$ 0.30
50$ 0.28
100$ 0.26
250$ 0.25
500$ 0.24
1000$ 0.22

Description

General part information

BGS12P2 Series

The BGS12P2L6 is a general purpose high power SPDT switch, designed to cover a broad range applications from 0.05 to 6 GHz and therefore excellent for 5G sub-6 GHz. Its outstanding RF performance optimizes the transmitting path (TRx) of LTE/5G mobile phones. The chip integrates on-chip CMOS logic driven by a simple, single-pin CMOS or TTL compatible control input signal. Unlike GaAs technology, external DC blocking capacitors at the RF ports are only required if DC voltage is applied externally. The BGS12P2L6 RF switch is manufactured in Infineon’s patented MOS technology, offering the performance of GaAs with the economy and integration of conventional CMOS including the inherent higher ESD robustness. The device has a very small size of only 0.7 x 1.1 mm2 and a maximum height of 0.31 mm.

Documents

Technical documentation and resources