RGTH60TK65GC11
ActiveRohm Semiconductor
HIGH-SPEED SWITCHING TYPE, 650V 30A, TO-3PFM, FIELD STOP TRENCH IGBT
RGTH60TK65GC11
ActiveRohm Semiconductor
HIGH-SPEED SWITCHING TYPE, 650V 30A, TO-3PFM, FIELD STOP TRENCH IGBT
Description
General part information
RGTH60TK65 Series
ROHM's IGBT products will contribute to energy saving high efficiency and a wide range of high voltage and high-current applications.
Technical Specifications
Parameters and characteristics for this part
| Specification | RGTH60TK65GC11 |
|---|---|
| Current - Collector (Ic) (Max) | 28 A |
| Current - Collector Pulsed (Icm) | 120 A |
| Gate Charge | 58 nC |
| IGBT Type | Trench Field Stop |
| Input Type | Standard |
| Mounting Type | Through Hole |
| Operating Temperature (Max) | 175 °C |
| Operating Temperature (Min) | -40 °C |
| Package / Case | TO-3PFM, SC-93-3 |
| Package Name | TO-3PFM |
| Power - Max | 61 W |
| Td (off) @ 25°C | 105 ns |
| Td (on) @ 25°C | 27 ns |
| Test Condition Current | 30 A |
| Test Condition Resistance | 10 Ohm |
| Test Condition Voltage | 400 V |
| Test Condition Voltage (Secondary) | 15 V |
| Vce(on) (Max) | 2.1 V |
| Voltage - Collector Emitter Breakdown (Max) | 650 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Technical Data Sheet EN
Two-Resistor Model for Thermal Simulation
How to Use LTspice® Models
Precautions When Measuring the Rear of the Package with a Thermocouple
The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level
Inner Structure
About Export Administration Regulations (EAR)
Generation Mechanism of Voltage Surge on Commutation Side (Basic)
What Is Thermal Design
4 Steps for Successful Thermal Designing of Power Devices
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Part Explanation
How to Use the Thermal Resistance and Thermal Characteristics Parameters
What is a Thermal Model? (IGBT)
Anti-Whisker formation
Estimation of switching losses in IGBTs operating with resistive load
Notes for Calculating Power Consumption:Static Operation
Calculation of Power Dissipation in Switching Circuit
Explanation for Marking
About Flammability of Materials
Package Dimensions
Impedance Characteristics of Bypass Capacitor
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
θ<sub>JC</sub> and Ψ<sub>JT</sub>
How to Use LTspice® Models: Tips for Improving Convergence
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Method for Monitoring Switching Waveform
PCB Layout Thermal Design Guide
Precautions for Thermal Resistance of Insulation Sheet
Notes for Temperature Measurement Using Thermocouples
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Compliance of the ELV directive
Condition of Soldering
Basics of Thermal Resistance and Heat Dissipation
Power Eco Family: Overview of ROHM's Power Semiconductor Lineup
Moisture Sensitivity Level
Taping Information
Measurement Method and Usage of Thermal Resistance RthJC
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Types and Features of Transistors
Judgment Criteria of Thermal Evaluation
How to Create Symbols for PSpice Models
Reliability Test Result
Importance of Probe Calibration When Measuring Power: Deskew
Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules