BD3465FV-E2
ActiveRohm Semiconductor
GENERAL PURPOSE ELECTRIC VOLUME WITH BUILT-IN ADVANCED SWITCH
BD3465FV-E2
ActiveRohm Semiconductor
GENERAL PURPOSE ELECTRIC VOLUME WITH BUILT-IN ADVANCED SWITCH
Description
General part information
BD3465FV Series
This series features 6ch/8ch electronic volume for faders. The advanced switch mitigates shock noise during volume switching.
Technical Specifications
Parameters and characteristics for this part
| Specification | BD3465FV-E2 |
|---|---|
| Applications | Audio |
| Function | Volume Control |
| Grade | Automotive |
| Interface | I2C |
| Mounting Type | Surface Mount |
| Number of Channels | 4 |
| Operating Temperature (Max) | 85 °C |
| Operating Temperature (Min) | -40 °C |
| Package Length | 0.173 in |
| Package Name | 20-LSSOP, 20-SSOP-B |
| Package Width | 4.4 mm |
| Voltage - Supply (Maximum) | 9.5 V |
| Voltage - Supply (Minimum) | 7 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
PCB Layout Thermal Design Guide
Factory Information
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Solder Joint Rate and Thermal Resistance of Exposed Pad
Compliance with the ELV directive
Basics of Thermal Resistance and Heat Dissipation
Thermal Resistance
θ<sub>JA</sub> and Ψ<sub>JT</sub>
θ<sub>JC</sub> and Ψ<sub>JT</sub>
UL94 Flame Classifications of Mold Compound
Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Design Guide and Example of Stencil for Exposed Pad
SSOP-B20 Package Information
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Five Steps for Successful Thermal Design of IC
Judgment Criteria of Thermal Evaluation
Impedance Characteristics of Bypass Capacitor
What Is Thermal Design
Anti-Whisker formation