MCP23008T-E/SO

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Microchip Technology

IC,I/O PORT,8-BIT,SOP,18PIN,PLASTIC ROHS COMPLIANT: YES

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MCP23008T-E/SO

Active

Microchip Technology

IC,I/O PORT,8-BIT,SOP,18PIN,PLASTIC ROHS COMPLIANT: YES

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Description Specifications Series Pricing CAD Documents

Description

General part information

MCP23008 Series

The MCP23X08 device provides 8-bit, general purpose, parallel I/O expansion for I2C bus or SPI applications. The two devices differ in the number of hardware address pins and the serial interface:

• MCP23008 – I2C interface; three address pins

• MCP23S08 – SPI interface; two address pins

Technical Specifications

Parameters and characteristics for this part

Specification	MCP23008T-E/SO

Clock Frequency	1.7 MHz
Current - Output Source/Sink	25 mA
Features	POR
Interface	I2C
Interrupt Output	Yes
Mounting Type	Surface Mount
Number of I/O	8
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-40 °C
Output Type	Push-Pull
Package Length	0.295 in
Package Name	18-SOIC
Package Width	7.5 mm
Voltage - Supply (Maximum)	5.5 V
Voltage - Supply (Minimum)	1.8 V

MCP23008 Series

8-Bit I2C I/O Expander with Serial Interface

Part	Package Length	Package Name	Package Width	Output Type	Clock Frequency	Number of I/O	Current - Output Source/Sink	Interrupt Output	Mounting Type	Interface	Features	Operating Temperature (Max)	Operating Temperature (Min)	Voltage - Supply (Maximum)	Voltage - Supply (Minimum)	Grade	Qualification	Package / Case
Microchip Technology MCP23008-E/P	0.3 in	18-DIP 18-PDIP	7.62 mm	Push-Pull	1.7 MHz	8	25 mA	Yes	Through Hole	I2C	POR	125 °C	-40 °C	5.5 V	1.8 V
Microchip Technology MCP23008T-E/SO	0.295 in	18-SOIC	7.5 mm	Push-Pull	1.7 MHz	8	25 mA	Yes	Surface Mount	I2C	POR	125 °C	-40 °C	5.5 V	1.8 V
Microchip Technology MCP23008T-E/SSVAO	0.209 in	20-SSOP	5.3 mm	Push-Pull	1.7 MHz 10 MHz	8	25 mA	Yes	Surface Mount	I2C	POR	125 °C	-40 °C	5.5 V	1.8 V 4.5 V	Automotive	AEC-Q100
Microchip Technology MCP23008-E/SSVAO	0.209 in	20-SSOP	5.3 mm	Push-Pull	1.7 MHz	8	25 mA	Yes	Surface Mount	I2C	POR	125 °C	-40 °C	5.5 V	1.8 V	Automotive	AEC-Q100
Microchip Technology MCP23008-E/SS	0.209 in	20-SSOP	5.3 mm	Push-Pull	1.7 MHz	8	25 mA	Yes	Surface Mount	I2C	POR	125 °C	-40 °C	5.5 V	1.8 V
Microchip Technology MCP23008T-E/ML	4 mm	20-QFN	4 mm	Push-Pull	1.7 MHz	8	25 mA	Yes	Surface Mount	I2C	POR	125 °C	-40 °C	5.5 V	1.8 V			20-VFQFN Exposed Pad
Microchip Technology MCP23008T-E/SS	0.209 in	20-SSOP	5.3 mm	Push-Pull	1.7 MHz	8	25 mA	Yes	Surface Mount	I2C	POR	125 °C	-40 °C	5.5 V	1.8 V
Microchip Technology MCP23008-E/ML	4 mm	20-QFN	4 mm	Push-Pull	1.7 MHz	8	25 mA	Yes	Surface Mount	I2C	POR	125 °C	-40 °C	5.5 V	1.8 V			20-VFQFN Exposed Pad
Microchip Technology MCP23008-E/SO	0.295 in	18-SOIC	7.5 mm	Push-Pull	1.7 MHz	8	25 mA	Yes	Surface Mount	I2C	POR	125 °C	-40 °C	5.5 V	1.8 V