68-PGM11033-10H

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Aries Electronics

CONN SOCKET PGA GOLD

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68-PGM11033-10H

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Aries Electronics

CONN SOCKET PGA GOLD

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Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	33	$ 13.35

Description

General part information

68-PGM1 Series

Pos PGA Socket Gold Through Hole

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Technical documentation and resources

Datasheet

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	68-PGM11033-10H	68-PGM1 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Tin	Tin, Gold
Contact Finish Thickness - Mating	10 çin	10 çin
Contact Finish Thickness - Mating	0.25 çm	0.25 çm
Contact Finish Thickness - Post	200 µin	10 - 200 µin
Contact Finish Thickness - Post	5.08 µm	0.25 - 5.08 µm
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post [custom]	Brass	Brass
Current Rating (Amps)	3 A	3 A
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole
Operating Temperature [Max]	105 ░C	105 - 125 ░C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch - Mating	0.1 in	0.1 in
Pitch - Mating	2.54 mm	2.54 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Solder	Solder
Termination Post Length	0.165 in	0.125 - 0.165 in
Termination Post Length	4.19 mm	3.18 - 4.19 mm
Type	PGA	PGA

68-PGM1 Series

CONN SOCKET PGA GOLD

Part	Material Flammability Rating	Contact Finish - Post	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type	Contact Material - Post [custom]	Housing Material	Pitch - Mating	Pitch - Mating	Mounting Type	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Current Rating (Amps)	Pitch - Post	Pitch - Post	Termination	Termination Post Length	Termination Post Length	Operating Temperature [Max]	Operating Temperature [Min]
Aries Electronics 68-PGM11033-10H	UL94 V-0	Tin	Gold	10 çin	0.25 çm	PGA	Brass	Glass Filled, Nylon 4/6, Polyamide (PA46)	0.1 in	2.54 mm	Through Hole	Beryllium Copper	200 µin	5.08 µm	3 A	2.54 mm	0.1 in	Solder	0.165 in	4.19 mm	105 ░C	-55 °C
Aries Electronics 68-PGM10006-10	UL94 V-0	Tin	Gold	10 çin	0.25 çm	PGA	Brass	Glass Filled, Nylon 4/6, Polyamide (PA46)	0.1 in	2.54 mm	Through Hole	Beryllium Copper	200 µin	5.08 µm	3 A	2.54 mm	0.1 in	Solder	0.125 in	3.18 mm
Aries Electronics 68-PGM10005-11H	UL94 V-0	Gold	Gold	10 çin	0.25 çm	PGA	Brass	Glass Filled, Nylon 4/6, Polyamide (PA46)	0.1 in	2.54 mm	Through Hole	Beryllium Copper	10 çin	0.25 çm	3 A	2.54 mm	0.1 in	Solder	0.165 in	4.19 mm	125 °C	-55 °C
Aries Electronics 68-PGM11033-11	UL94 V-0	Gold	Gold	10 çin	0.25 çm	PGA	Brass	Glass Filled, Nylon 4/6, Polyamide (PA46)	0.1 in	2.54 mm	Through Hole	Beryllium Copper	10 çin	0.25 çm	3 A	2.54 mm	0.1 in	Solder	0.165 in	4.19 mm	125 °C	-55 °C
Aries Electronics 68-PGM11033-10	UL94 V-0	Tin	Gold	10 çin	0.25 çm	PGA	Brass	Glass Filled, Nylon 4/6, Polyamide (PA46)	0.1 in	2.54 mm	Through Hole	Beryllium Copper	200 µin	5.08 µm	3 A	2.54 mm	0.1 in	Solder	0.165 in	4.19 mm	105 ░C	-55 °C
Aries Electronics 68-PGM11032-10	UL94 V-0	Tin	Gold	10 çin	0.25 çm	PGA	Brass	Glass Filled, Nylon 4/6, Polyamide (PA46)	0.1 in	2.54 mm	Through Hole	Beryllium Copper	200 µin	5.08 µm	3 A	2.54 mm	0.1 in	Solder	0.165 in	4.19 mm	105 ░C	-55 °C