68-PGM1 Series

Catalog

CONN SOCKET PGA GOLD

Part	Material Flammability Rating	Contact Finish - Post	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type	Contact Material - Post [custom]	Housing Material	Pitch - Mating	Pitch - Mating	Mounting Type	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Current Rating (Amps)	Pitch - Post	Pitch - Post	Termination	Termination Post Length	Termination Post Length	Operating Temperature [Max]	Operating Temperature [Min]
Aries Electronics 68-PGM11033-10H	UL94 V-0	Tin	Gold	10 çin	0.25 çm	PGA	Brass	Glass Filled, Nylon 4/6, Polyamide (PA46)	0.1 in	2.54 mm	Through Hole	Beryllium Copper	200 µin	5.08 µm	3 A	2.54 mm	0.1 in	Solder	0.165 in	4.19 mm	105 ░C	-55 °C
Aries Electronics 68-PGM10006-10	UL94 V-0	Tin	Gold	10 çin	0.25 çm	PGA	Brass	Glass Filled, Nylon 4/6, Polyamide (PA46)	0.1 in	2.54 mm	Through Hole	Beryllium Copper	200 µin	5.08 µm	3 A	2.54 mm	0.1 in	Solder	0.125 in	3.18 mm
Aries Electronics 68-PGM10005-11H	UL94 V-0	Gold	Gold	10 çin	0.25 çm	PGA	Brass	Glass Filled, Nylon 4/6, Polyamide (PA46)	0.1 in	2.54 mm	Through Hole	Beryllium Copper	10 çin	0.25 çm	3 A	2.54 mm	0.1 in	Solder	0.165 in	4.19 mm	125 °C	-55 °C
Aries Electronics 68-PGM11033-11	UL94 V-0	Gold	Gold	10 çin	0.25 çm	PGA	Brass	Glass Filled, Nylon 4/6, Polyamide (PA46)	0.1 in	2.54 mm	Through Hole	Beryllium Copper	10 çin	0.25 çm	3 A	2.54 mm	0.1 in	Solder	0.165 in	4.19 mm	125 °C	-55 °C
Aries Electronics 68-PGM11033-10	UL94 V-0	Tin	Gold	10 çin	0.25 çm	PGA	Brass	Glass Filled, Nylon 4/6, Polyamide (PA46)	0.1 in	2.54 mm	Through Hole	Beryllium Copper	200 µin	5.08 µm	3 A	2.54 mm	0.1 in	Solder	0.165 in	4.19 mm	105 ░C	-55 °C
Aries Electronics 68-PGM11032-10	UL94 V-0	Tin	Gold	10 çin	0.25 çm	PGA	Brass	Glass Filled, Nylon 4/6, Polyamide (PA46)	0.1 in	2.54 mm	Through Hole	Beryllium Copper	200 µin	5.08 µm	3 A	2.54 mm	0.1 in	Solder	0.165 in	4.19 mm	105 ░C	-55 °C