R4P030N03HZGT100
ActiveRohm Semiconductor
MOSFET, N-CHANNEL, 30V, 3A, SOT-89 ROHS COMPLIANT: YES
R4P030N03HZGT100
ActiveRohm Semiconductor
MOSFET, N-CHANNEL, 30V, 3A, SOT-89 ROHS COMPLIANT: YES
Description
General part information
R4P030N03HZG Series
R4P030N03HZG is an automotive grade MOSFET that is AEC-Q101 qualified. Ideal for Switching
Technical Specifications
Parameters and characteristics for this part
| Specification | R4P030N03HZGT100 |
|---|---|
| Current - Continuous Drain (Id) (Ta) | 3 A |
| Drain to Source Voltage (Vdss) | 30 V |
| Drive Voltage (Max Rds On) | 4 V |
| Drive Voltage (Min Rds On) | 10 V |
| FET Type | N-Channel |
| Gate Charge (Max) | 6.5 nC |
| Grade | Automotive |
| Input Capacitance (Ciss) (Max) | 160 pF |
| Mounting Type | Surface Mount |
| Operating Temperature | 150 °C |
| Package / Case | TO-243AA |
| Package Name | SOT-89 |
| Power Dissipation (Max) | 500 mW |
| Qualification | AEC-Q101 |
| Rds On (Max) | 120 mOhm |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 20 V |
| Vgs(th) (Max) | 2.5 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
R4P030N03HZGT100 | Datasheet
Anti-Whisker formation - Transistors
Moisture Sensitivity Level - Transistors
Precautions When Measuring the Rear of the Package with a Thermocouple
θ<sub>JA</sub> and Ψ<sub>JT</sub>
MOSFET Gate Resistor Setting for Motor Driving
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Taping Information
List of Transistor Package Thermal Resistance
Measurement Method and Usage of Thermal Resistance RthJC
About Flammability of Materials
Compliance of the RoHS directive
Condition of Soldering / Land Pattern Reference
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Part Explanation
Notes for Calculating Power Consumption:Static Operation
What Is Thermal Design
Basics of Thermal Resistance and Heat Dissipation
Notes for Temperature Measurement Using Thermocouples
What is a Thermal Model? (Transistor)
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Impedance Characteristics of Bypass Capacitor
Judgment Criteria of Thermal Evaluation
Temperature derating method for Safe Operating Area (SOA)
How to Use LTspice® Models
PCB Layout Thermal Design Guide
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
About Export Regulations
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Package Dimensions
Method for Monitoring Switching Waveform
MOSFET Gate Drive Current Setting for Motor Driving
Importance of Probe Calibration When Measuring Power: Deskew
Report of SVHC under REACH Regulation
How to Use LTspice® Models: Tips for Improving Convergence
Two-Resistor Model for Thermal Simulation
Explanation for Marking
Types and Features of Transistors
Calculation of Power Dissipation in Switching Circuit