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JANS1N5712UBCC

JANS1N5712UBCC

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Microchip Technology

DIODE SCHOTTKY 4-PIN CASE UB WAFFLE

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JANS1N5712UBCC

JANS1N5712UBCC

Active
Microchip Technology

DIODE SCHOTTKY 4-PIN CASE UB WAFFLE

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Description

General part information

1N5712 Series

This Schottky barrier diode is metallurgically bonded and offers military grade qualifications for high-reliability applications. This small diode is hermetically sealed and bonded into a DO-213AA glass package. Also included in this datasheet are Microchip’s CDLL numbered variants of this series (military qualification grades not are not available for the CDLL prefix part numbers).

Technical Specifications

Parameters and characteristics for this part

SpecificationJANS1N5712UBCC
Current - Average Rectified (Io) (per Diode)75 mA
Current - Reverse Leakage150 nA
Diode ConfigurationCommon Cathode
Diode Pair Count1 pair
GradeMilitary
Mounting TypeSurface Mount
Operating Temperature - Junction (Max)150 °C
Operating Temperature - Junction (Min)-65 °C
Package / Case4-SMD, No Lead
Package NameUB
QualificationMIL-PRF-19500, 444
SpeedAny Speed, Small Signal
Speed - Fast Recovery (Maximum)200 mA
Speed - Small Signal Current Max200 mA, 200 mA, 200 mA
TechnologySchottky
Voltage - DC Reverse (Vr) (Max)16 V
Voltage - Forward (Vf) (Max)1 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

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CAD

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Documents

Technical documentation and resources