BAS16QA-QZ
ActiveNexperia USA Inc.
BAS16QA-Q/SOT1215/DFN1010D-3
BAS16QA-QZ
ActiveNexperia USA Inc.
BAS16QA-Q/SOT1215/DFN1010D-3
Description
General part information
BAS16QA-Q Series
Single high-speed switching diode encapsulated in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.
Technical Specifications
Parameters and characteristics for this part
| Specification | BAS16QA-QZ |
|---|---|
| Capacitance | 1.5 pF |
| Current - Average Rectified (Io) | 290 mA |
| Current - Reverse Leakage | 500 µA |
| Grade | Automotive |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction | 150 °C |
| Package / Case | 3-XDFN Exposed Pad |
| Package Name | DFN1010D-3 |
| Qualification | AEC-Q101 |
| Reverse Recovery Time (trr) | 4 ns |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Standard |
| Voltage - DC Reverse (Vr) (Max) | 100 V |
| Voltage - Forward (Vf) (Max) | 1.25 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); 3 terminals; 0.75 mm pitch; 1.1 mm x 1 mm x 0.37 mm body
Questions about package outline drawings
DFN1010D-3; Reel pack, SMD, 7"; Q2/T3 standard product orientation; Orderable part number ending ,147 or Z; Ordering code (12NC) ending 147
Nexperia package poster
BAS16QA-Q Nexperia Product Reliability
plastic, thermal enhanced ultra thin small outline package; 3 terminals; 0.75 mm pitch; 1.1 mm x 1 mm x 0.37 mm body
Reflow soldering profile