
PMDXB600UNELZ
ActiveNexperia USA Inc.
20 V, DUAL N-CHANNEL TRENCH MOSFET

PMDXB600UNELZ
ActiveNexperia USA Inc.
20 V, DUAL N-CHANNEL TRENCH MOSFET
Description
General part information
PMDXB600 Series
Dual N-channel enhancement mode Field-Effect Transistor (FET) in a leadless ultra small DFN1010B-6 (SOT1216) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
Technical Specifications
Parameters and characteristics for this part
| Specification | PMDXB600UNELZ |
|---|---|
| Channel Count | 2 |
| Configuration | N-Channel |
| Configuration - Features | Dual |
| Current - Continuous Drain (Id) | 600 mA |
| Drain to Source Voltage (Vdss) | 20 V |
| Gate Charge (Max) | 0.7 nC |
| Input Capacitance (Ciss) (Max) | 21.3 pF |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 150 °C |
| Operating Temperature (Min) | -55 °C |
| Package / Case | 6-XFDFN Exposed Pad |
| Package Name | DFN1010B-6 |
| Power - Max | 380 mW |
| Technology | MOSFET (Metal Oxide) |
| Vgs(th) (Max) | 950 mV |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Low temperature soldering, application study
Thermal performance of DFN packages
plastic, leadless thermal enhanced ultra thin small outline package; 6 terminals; 0.35 mm pitch; 1.1 mm x 1 mm x 0.37 mm body
Nexperia package poster
Reflow soldering profile
DFN1010B-6; Reel pack for SMD, 7''; Q2/T3 product orientation
Leakage of small-signal MOSFETs
Questions about package outline drawings
Level shifting techniques in I2C-bus design
plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.75 mm pitch; 1.1 mm x 1 mm x 0.37 mm body