TVS510
ActiveDIODE TVS SINGLE 10V 500W 2-PIN CASE B-(WT)
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TVS510
ActiveDIODE TVS SINGLE 10V 500W 2-PIN CASE B-(WT)
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Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | TVS510 | TVS510-e3 Series |
|---|---|---|
| - | - | |
| Applications | General Purpose | General Purpose |
| Current - Peak Pulse (10/1000µs) | 30.3 A | 30.3 A |
| Mounting Type | Through Hole | Through Hole |
| Operating Temperature [Max] | 175 ░C | 175 ░C |
| Operating Temperature [Min] | -65 °C | -65 °C |
| Package / Case | Axial, B | Axial, B |
| Power - Peak Pulse | 500 W | 500 W |
| Power Line Protection | False | False |
| Supplier Device Package | B, Axial | B, Axial |
| Type | Zener | Zener |
| Unidirectional Channels [custom] | 1 | 1 |
| Voltage - Breakdown (Min) [Min] | 11.1 V | 11.1 V |
| Voltage - Clamping (Max) @ Ipp [Max] | 16.5 V | 16.5 V |
| Voltage - Reverse Standoff (Typ) | 10 V | 10 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 100 | $ 9.81 | |
| Microchip Direct | N/A | 1 | $ 10.57 | |
TVS510-e3 Series
500W Transient Voltage Suppressor
| Part | Applications | Current - Peak Pulse (10/1000µs) | Package / Case | Voltage - Breakdown (Min) [Min] | Supplier Device Package | Type | Voltage - Clamping (Max) @ Ipp [Max] | Unidirectional Channels [custom] | Operating Temperature [Max] | Operating Temperature [Min] | Voltage - Reverse Standoff (Typ) | Power Line Protection | Mounting Type | Power - Peak Pulse |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology TVS510 | ||||||||||||||
Microchip Technology TVS510 | General Purpose | 30.3 A | Axial, B | 11.1 V | B, Axial | Zener | 16.5 V | 1 | 175 ░C | -65 °C | 10 V | Through Hole | 500 W |
Description
General part information
TVS510-e3 Series
Microchips TVS Series of transient voltage suppressors feature oxide passivated Zener type chips with full-faced metallurgical bonds on both sides to achieve high surge capability and negligible electrical degradation under repeated surge conditions. The series is especially useful in protecting microprocessor, MOS, CMOS, TTL and linear integrated circuits from spurious transient disturbances.
Documents
Technical documentation and resources