36-6511-10

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Aries Electronics

CONN IC DIP SOCKET 36POS TIN

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Aries Electronics

CONN IC DIP SOCKET 36POS TIN

Technical Specifications

Parameters and characteristics for this part

Specification	36-6511-10

Contact Finish - Post	Tin
Contact Finish Thickness - Mating	5.08 µm
Contact Finish Thickness - Mating	200 µin
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Phosphor Bronze
Contact Material - Post	Phosphor Bronze
Current Rating (Amps)	1 A
Features	Closed Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	36
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.15 in
Termination Post Length	3.81 mm
Type	DIP
Type	0.6 in
Type	15.24 mm

Part	Pitch - Post	Pitch - Post	Operating Temperature [Max]	Operating Temperature [Min]	Termination Post Length	Termination Post Length	Material Flammability Rating	Contact Material - Post	Pitch - Mating	Pitch - Mating	Contact Material - Mating	Housing Material	Number of Positions or Pins (Grid)	Current Rating (Amps)	Features	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Mounting Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type	Type	Type
Aries Electronics 36-6511-10	2.54 mm	0.1 in	105 ░C	-55 °C	0.15 in	3.81 mm	UL94 V-0	Phosphor Bronze	0.1 in	2.54 mm	Phosphor Bronze	Glass Filled Nylon 4/6 Polyamide (PA46)	36	1 A	Closed Frame	Tin	5.08 µm	200 µin	Solder	Through Hole	200 µin	5.08 µm	DIP	0.6 in	15.24 mm

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	96	$ 5.30

General part information

36 (2 x 18) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Tin Through Hole

Technical documentation and resources