UPD70F3373M2GKA-GAK-E2-QS-AX

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Renesas Electronics Corporation

IC MCU 32BIT

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Renesas Electronics Corporation

IC MCU 32BIT

Technical Specifications

Parameters and characteristics for this part

Specification	UPD70F3373M2GKA-GAK-E2-QS-AX

Connectivity	LINbus, CANbus, UART/USART, CSI, I2C
Core Processor	V850ES
Core Size	32-Bit Single-Core
Data Converters	12, 10 b
EEPROM Size	32 K
Mounting Type	Surface Mount
Number of I/O	67
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Oscillator Type	Internal
Package / Case	80-LQFP
Peripherals	DMA, LVD, PWM, POR, WDT
Program Memory Size	256 KB
Program Memory Type	FLASH
RAM Size	16 K
Speed	32 MHz
Supplier Device Package	80-LFQFP (12x12)
Voltage - Supply (Vcc/Vdd) [Max]	5.5 V
Voltage - Supply (Vcc/Vdd) [Min]	3.3 V

IC MCU 32BIT

Part	Voltage - Supply (Vcc/Vdd) [Min]	Voltage - Supply (Vcc/Vdd) [Max]	Data Converters	Core Processor	RAM Size	Operating Temperature [Max]	Operating Temperature [Min]	Mounting Type	Peripherals	EEPROM Size	Core Size	Package / Case	Supplier Device Package	Speed	Connectivity	Number of I/O	Program Memory Type	Program Memory Size	Oscillator Type
Renesas Electronics Corporation UPD70F3373M2GKA-GAK-E2-QS-AX	3.3 V	5.5 V	10 b, 12	V850ES	16 K	85 °C	-40 °C	Surface Mount	DMA, LVD, POR, PWM, WDT	32 K	32-Bit Single-Core	80-LQFP	80-LFQFP (12x12)	32 MHz	CANbus, CSI, I2C, LINbus, UART/USART	67	FLASH	256 KB	Internal

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

General part information

V850ES V850ES/FF3 Microcontroller IC 32-Bit Single-Core 32MHz 256KB (256K x 8) FLASH 80-LFQFP (12x12)

Technical documentation and resources

No documents available