
BU9882FV-WE2
ActiveRohm Semiconductor
1K X 2CH, I²C BUS, EEPROM FOR EDID

BU9882FV-WE2
ActiveRohm Semiconductor
1K X 2CH, I²C BUS, EEPROM FOR EDID
Description
General part information
BU9882FV-W Series
ROHM's serial EEPROM series are optimized for displays as well as Plug & Play memory modules.
Technical Specifications
Parameters and characteristics for this part
| Specification | BU9882FV-WE2 |
|---|---|
| Clock Frequency | 400 kHz |
| Memory Depth (Config 1) | 128 |
| Memory Format | EEPROM |
| Memory Instances (Config 2) | 2 |
| Memory Interface (Type) | Serial |
| Memory Size | 2 Kbit |
| Memory Type | Non-Volatile |
| Memory Width (Config 1) | 8 bit |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 85 °C |
| Operating Temperature (Min) | -40 °C |
| Package Length | 0.173 in |
| Package Name | 14-SSOP-B, 14-LSSOP |
| Package Width | 4.4 mm |
| Technology | EEPROM |
| Voltage - Supply (Maximum) | 5.5 V |
| Voltage - Supply (Minimum) | 2.5 V |
| Write Cycle Time - Page | 10 ms |
| Write Cycle Time - Word | 10 ms |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Anti-Whisker formation
Compliance with the ELV directive
SSOP-B14 Package Information
UL94 Flame Classifications of Mold Compound
Design Guide and Example of Stencil for Exposed Pad
Impedance Characteristics of Bypass Capacitor
What Is Thermal Design
Thermal Resistance
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
BU9882FV-W Data Sheet
Factory Information
Basics of Thermal Resistance and Heat Dissipation
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package
Five Steps for Successful Thermal Design of IC
Solder Joint Rate and Thermal Resistance of Exposed Pad