XC3S1200E-4FTG256I

Obsolete

AMD

IC FPGA 190 I/O 256FTBGA

Search across all available documentation for this part.

Obsolete

AMD

IC FPGA 190 I/O 256FTBGA

Technical Specifications

Parameters and characteristics for this part

Specification	XC3S1200E-4FTG256I

Mounting Type	Surface Mount
Number of Gates	1200000
Number of I/O	190
Number of LABs/CLBs	2168 LABs/CLBs
Number of Logic Elements/Cells	19512
Operating Temperature [Max]	100 °C
Operating Temperature [Min]	-40 C
Package / Case	256-LBGA
Supplier Device Package	256-FTBGA (17x17)
Total RAM Bits	516096 Bits

Part	Operating Temperature [Max]	Operating Temperature [Min]	Number of Logic Elements/Cells	Number of I/O	Mounting Type	Number of Gates	Number of LABs/CLBs	Total RAM Bits	Package / Case	Supplier Device Package
AMD XC3S1200E-4FG320I	100 °C	-40 C	19512	250	Surface Mount	1200000	2168 LABs/CLBs	516096 Bits	320-BGA	320-FBGA (19x19)
AMD XC3S1200E-5FGG400C	85 °C	0 °C	19512	304	Surface Mount	1200000	2168 LABs/CLBs	516096 Bits	400-BGA	400-FBGA (21x21)
AMD XC3S1200E-4FTG256I	100 °C	-40 C	19512	190	Surface Mount	1200000	2168 LABs/CLBs	516096 Bits	256-LBGA	256-FTBGA (17x17)
AMD XC3S1200E-5FG400C	85 °C	0 °C	19512	304	Surface Mount	1200000	2168 LABs/CLBs	516096 Bits	400-BGA	400-FBGA (21x21)

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

General part information

Spartan®-3E Field Programmable Gate Array (FPGA) IC 190 516096 19512 256-LBGA

Technical documentation and resources

No documents available