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HTSW-207-18-G-S - Samtec-HTSW-207-18-G-S Connector Headers and PCB Receptacles Conn Unshrouded Header HDR 7 POS 5.08mm Solder ST Top Entry Thru-Hole Bulk

HTSW-207-18-G-S

Active
Samtec Inc.

CONN UNSHROUDED HEADER HDR 7 POS 5.08MM SOLDER ST TOP ENTRY THRU-HOLE BULK

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HTSW-207-18-G-S - Samtec-HTSW-207-18-G-S Connector Headers and PCB Receptacles Conn Unshrouded Header HDR 7 POS 5.08mm Solder ST Top Entry Thru-Hole Bulk

HTSW-207-18-G-S

Active
Samtec Inc.

CONN UNSHROUDED HEADER HDR 7 POS 5.08MM SOLDER ST TOP ENTRY THRU-HOLE BULK

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationHTSW-207-18-G-S
Connector TypeHeader
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating10 çin
Contact Finish Thickness - Mating0.25 çm
Contact Finish Thickness - Post3 µin
Contact Finish Thickness - Post0.076 µm
Contact Length - Mating0.72 in
Contact Length - Mating18.29 mm
Contact Length - Post2.79 mm
Contact Length - Post [x]0.11 in
Contact MaterialPhosphor Bronze
Contact ShapeSquare
Contact TypeMale Pin
Current Rating (Amps)Varies by Wire Gauge
Fastening TypePush-Pull
Insulation ColorNatural
Insulation Height0.1 in
Insulation Height2.54 mm
Insulation MaterialLiquid Crystal Polymer (LCP)
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions7
Number of Positions LoadedAll
Number of Rows1
Operating Temperature [Max]125 °C
Operating Temperature [Min]-55 °C
Overall Contact Length0.93 in
Overall Contact Length23.62 mm
Pitch - Mating5.08 mm
Pitch - Mating0.2 in
ShroudingUnshrouded
StyleBoard to Board, Cable
TerminationSolder

HTSW-207 Series

PartPitch - MatingPitch - MatingMaterial Flammability RatingInsulation HeightInsulation HeightContact Finish - PostOperating Temperature [Min]Operating Temperature [Max]Number of PositionsInsulation ColorShroudingContact Length - Mating [x]Contact Length - MatingNumber of RowsRow Spacing - Mating [x]Row Spacing - Mating [x]Connector TypeContact MaterialContact TypeFastening TypeContact Finish Thickness - MatingContact Finish Thickness - MatingContact Length - PostContact Length - PostMounting TypeContact ShapeTerminationCurrent Rating (Amps)StyleNumber of Positions LoadedContact Finish - MatingInsulation MaterialContact Finish Thickness - PostContact Finish Thickness - PostContact Length - Post [x]Contact Length - Post [x]Contact Length - MatingOverall Contact LengthOverall Contact Length
5.08 mm
0.2 in
UL94 V-0
0.24 in
6.1 mm
Tin
-55 °C
125 °C
14
Natural
Unshrouded
0.23 in
5.84 mm
2
2.54 mm
0.1 in
Header
Phosphor Bronze
Male Pin
Push-Pull
30 Áin
0.76 Ám
0.09 "
2.29 mm
Through Hole
Right Angle
Square
Solder
Varies by Wire Gauge
Board to Board
Cable
All
Gold
Liquid Crystal Polymer (LCP)
5.08 mm
0.2 in
UL94 V-0
0.24 in
6.1 mm
Gold
-55 °C
125 °C
14
Natural
Unshrouded
0.23 in
5.84 mm
2
2.54 mm
0.1 in
Header
Phosphor Bronze
Male Pin
Push-Pull
10 çin
0.25 çm
Through Hole
Right Angle
Square
Solder
Varies by Wire Gauge
Board to Board
Cable
All
Gold
Liquid Crystal Polymer (LCP)
3 µin
0.076 µm
0.79 in
20.07 mm
Samtec Inc.
5.08 mm
0.2 in
UL94 V-0
0.1 in
2.54 mm
Gold
-55 °C
125 °C
7
Natural
Unshrouded
18.29 mm
1
Header
Phosphor Bronze
Male Pin
Push-Pull
10 çin
0.25 çm
2.79 mm
Through Hole
Square
Solder
Varies by Wire Gauge
Board to Board
Cable
All
Gold
Liquid Crystal Polymer (LCP)
3 µin
0.076 µm
0.11 in
0.72 in
0.93 in
23.62 mm
Samtec Inc.
5.08 mm
0.2 in
UL94 V-0
0.1 in
2.54 mm
Tin
-55 °C
125 °C
7
Natural
Unshrouded
0.23 in
5.84 mm
1
Header
Phosphor Bronze
Male Pin
Push-Pull
30 Áin
0.76 Ám
0.1 in
2.54 mm
Through Hole
Square
Solder
Varies by Wire Gauge
Board to Board
Cable
All
Gold
Liquid Crystal Polymer (LCP)
0.43 in
10.92 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
ArrowN/A 1$ 2.53
50$ 2.06
100$ 1.75
DigikeyBulk 1$ 2.53

Description

General part information

HTSW-207 Series

Connector Header Through Hole 7 position 0.200" (5.08mm)

Documents

Technical documentation and resources

No documents available