MCP23S18-E/MJ

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Microchip Technology

I/O EXPANDER, 16BIT, 3.4 MHZ, I2C, SERIAL, SPI, 1.8 V, 5.5 V, QFN ROHS COMPLIANT: YES

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MCP23S18-E/MJ

Active

Microchip Technology

I/O EXPANDER, 16BIT, 3.4 MHZ, I2C, SERIAL, SPI, 1.8 V, 5.5 V, QFN ROHS COMPLIANT: YES

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Description Specifications Series Pricing CAD Documents

Description

General part information

MCP23S18 Series

The MCP23X18 device provides 16-bit, general purpose parallel I/O expansion for I2C bus or SPI applications. The two devices differ only in the serial interface.

• MCP23018 - I2C interface

• MCP23S18 - SPI interface

Technical Specifications

Parameters and characteristics for this part

Specification	MCP23S18-E/MJ

Clock Frequency	10 MHz
Current - Output Source/Sink	25 mA
Interface	SPI
Interrupt Output	Yes
Mounting Type	Surface Mount
Number of I/O	16
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-40 °C
Output Type	Open Drain
Package / Case	24-VFQFN Exposed Pad
Package Length	4 mm
Package Name	24-QFN
Package Width	4 mm
Voltage - Supply (Maximum)	5.5 V
Voltage - Supply (Minimum)	1.8 V

MCP23S18 Series

16-Bit SPI I/O Expander with Open-Drain Output

Part	Mounting Type	Interrupt Output	Operating Temperature (Max)	Operating Temperature (Min)	Package Width	Package Name	Package Length	Output Type	Number of I/O	Interface	Voltage - Supply (Maximum)	Voltage - Supply (Minimum)	Clock Frequency	Current - Output Source/Sink	Qualification	Grade	Features	Package / Case
Microchip Technology MCP23S18-E/SP	Through Hole	Yes	125 °C	-40 °C	7.62 mm	28-DIP 28-SPDIP	0.3 in	Open Drain	16	SPI	5.5 V	1.8 V	10 MHz	25 mA
Microchip Technology MCP23S18T-E/MJVAO	Surface Mount	Yes	125 °C	-40 °C	4 mm	24-QFN	4 mm	Open Drain	16	SPI	5.5 V	1.8 V	10 MHz	25 mA	AEC-Q100	Automotive	POR	24-VFQFN Exposed Pad
Microchip Technology MCP23S18-E/SO	Surface Mount	Yes	125 °C	-40 °C	7.5 mm	28-SOIC	0.295 in	Open Drain	16	SPI	5.5 V	1.8 V	10 MHz	25 mA
Microchip Technology MCP23S18T-E/MJ	Surface Mount	Yes	125 °C	-40 °C	4 mm	24-QFN	4 mm	Open Drain	16	SPI	5.5 V	1.8 V	10 MHz	25 mA				24-VFQFN Exposed Pad
Microchip Technology MCP23S18T-E/SO	Surface Mount	Yes	125 °C	-40 °C	7.5 mm	28-SOIC	0.295 in	Open Drain	16	SPI	5.5 V	1.8 V	10 MHz	25 mA
Microchip Technology MCP23S18-E/MJ	Surface Mount	Yes	125 °C	-40 °C	4 mm	24-QFN	4 mm	Open Drain	16	SPI	5.5 V	1.8 V	10 MHz	25 mA				24-VFQFN Exposed Pad