40-C300-20

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Aries Electronics

40P DIP GOLD BERYLLIUM COPPER ALLOY -55℃~+105℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

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Aries Electronics

40P DIP GOLD BERYLLIUM COPPER ALLOY -55℃~+105℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Technical Specifications

Parameters and characteristics for this part

Specification	40-C300-20

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Closed Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	40
Number of Positions or Pins (Grid) [custom]	20
Number of Positions or Pins (Grid) [custom]	2
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Wire Wrap
Termination Post Length	0.04 in
Termination Post Length	1.02 mm
Type	DIP
Type	0.6 in
Type	15.24 mm

Part	Mounting Type	Operating Temperature [Max]	Operating Temperature [Min]	Contact Material - Post [custom]	Contact Material - Mating	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Features	Termination Post Length	Termination Post Length	Type	Type	Type	Housing Material	Current Rating (Amps)	Termination
Aries Electronics 40-C300-00	Surface Mount	105 ░C	-55 °C	Brass	Beryllium Copper	2.54 mm	0.1 in	40	20	2	0.1 in	2.54 mm	200 µin	5.08 µm	Tin	UL94 V-0	10 çin	0.25 çm	Gold	Closed Frame	0.04 in	1.02 mm	DIP	0.6 in	15.24 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	3 A	Solder
Aries Electronics 40-C300-20	Through Hole	105 ░C	-55 °C	Brass	Beryllium Copper	2.54 mm	0.1 in	40	20	2	0.1 in	2.54 mm	200 µin	5.08 µm	Tin	UL94 V-0	10 çin	0.25 çm	Gold	Closed Frame	0.04 in	1.02 mm	DIP	0.6 in	15.24 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	3 A	Wire Wrap

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

40 (2 x 20) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Technical documentation and resources