W25X10CLSNIG TR

Active

Winbond Electronics

IC FLASH 1MBIT SPI 104MHZ 8SOIC

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsDatasheet

W25X10CLSNIG TR

Active

Winbond Electronics

IC FLASH 1MBIT SPI 104MHZ 8SOIC

Deep-Dive with AI

DocumentsDatasheet

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	W25X10CLSNIG TR	W25X10 Series

Clock Frequency	104 MHz	75 - 104 MHz
Memory Format	FLASH	FLASH
Memory Interface	SPI	SPI
Memory Organization	128K x 8	128K x 8
Memory Size	1 Mbit	1 Mbit
Memory Type	Non-Volatile	Non-Volatile
Mounting Type	Surface Mount	Surface Mount
Operating Temperature [Max]	85 °C	85 °C
Operating Temperature [Min]	-40 °C	-40 °C
Package / Case	8-SOIC	8-WDFN Exposed Pad, 8-SOIC, 8-UFDFN Exposed Pad
Package / Case [x]	0.154 in	0.154 in
Package / Case [y]	3.9 mm	3.9 mm
Supplier Device Package	8-SOIC	8-WSON (6x5), 8-SOIC, 8-USON (2x3)
Technology	FLASH	FLASH
Voltage - Supply [Max]	3.6 V	3.6 V
Voltage - Supply [Min]	2.3 V	2.3 - 2.7 V
Write Cycle Time - Word, Page	800 µs	3 - 800 µs

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

W25X10 Series

IC FLASH 1MBIT SPI 104MHZ 8WSON

Part	Technology	Operating Temperature [Max]	Operating Temperature [Min]	Memory Size	Memory Type	Package / Case	Write Cycle Time - Word, Page	Memory Format	Mounting Type	Memory Interface	Supplier Device Package	Voltage - Supply [Min]	Voltage - Supply [Max]	Clock Frequency	Memory Organization	Package / Case [y]	Package / Case [x]
Winbond Electronics W25X10CLZPIG	FLASH	85 °C	-40 °C	1 Mbit	Non-Volatile	8-WDFN Exposed Pad	800 µs	FLASH	Surface Mount	SPI	8-WSON (6x5)	2.3 V	3.6 V	104 MHz	128K x 8
Winbond Electronics W25X10CLSNIG TR	FLASH	85 °C	-40 °C	1 Mbit	Non-Volatile	8-SOIC	800 µs	FLASH	Surface Mount	SPI	8-SOIC	2.3 V	3.6 V	104 MHz	128K x 8	3.9 mm	0.154 in
Winbond Electronics W25X10VSNIG	FLASH	85 °C	-40 °C	1 Mbit	Non-Volatile	8-SOIC	3 ms	FLASH	Surface Mount	SPI	8-SOIC	2.7 V	3.6 V	75 MHz	128K x 8	3.9 mm	0.154 in
Winbond Electronics W25X10BVSNIG	FLASH	85 °C	-40 °C	1 Mbit	Non-Volatile	8-SOIC	3 ms	FLASH	Surface Mount	SPI	8-SOIC	2.7 V	3.6 V	104 MHz	128K x 8	3.9 mm	0.154 in
Winbond Electronics W25X10CLSNIG	FLASH	85 °C	-40 °C	1 Mbit	Non-Volatile	8-SOIC	800 µs	FLASH	Surface Mount	SPI	8-SOIC	2.3 V	3.6 V	104 MHz	128K x 8	3.9 mm	0.154 in
Winbond Electronics W25X10VZPIG	FLASH	85 °C	-40 °C	1 Mbit	Non-Volatile	8-WDFN Exposed Pad	3 ms	FLASH	Surface Mount	SPI	8-WSON (6x5)	2.7 V	3.6 V	75 MHz	128K x 8
Winbond Electronics W25X10CLZPIG TR	FLASH	85 °C	-40 °C	1 Mbit	Non-Volatile	8-WDFN Exposed Pad	800 µs	FLASH	Surface Mount	SPI	8-WSON (6x5)	2.3 V	3.6 V	104 MHz	128K x 8
Winbond Electronics W25X10AVSNIG	FLASH	85 °C	-40 °C	1 Mbit	Non-Volatile	8-SOIC	3 ms	FLASH	Surface Mount	SPI	8-SOIC	2.7 V	3.6 V	100 MHz	128K x 8	3.9 mm	0.154 in
Winbond Electronics W25X10BVZPIG	FLASH	85 °C	-40 °C	1 Mbit	Non-Volatile	8-WDFN Exposed Pad	3 ms	FLASH	Surface Mount	SPI	8-WSON (6x5)	2.7 V	3.6 V	104 MHz	128K x 8
Winbond Electronics W25X10CLUXIG TR	FLASH	85 °C	-40 °C	1 Mbit	Non-Volatile	8-UFDFN Exposed Pad	800 µs	FLASH	Surface Mount	SPI	8-USON (2x3)	2.3 V	3.6 V	104 MHz	128K x 8
Winbond Electronics W25X10VSNIG T&R	FLASH	85 °C	-40 °C	1 Mbit	Non-Volatile	8-SOIC	3 ms	FLASH	Surface Mount	SPI	8-SOIC	2.7 V	3.6 V	75 MHz	128K x 8	3.9 mm	0.154 in

Description

General part information

W25X10 Series

FLASH Memory IC 1Mbit SPI 104 MHz 8-SOIC

Documents

Technical documentation and resources