IC FLASH 1MBIT SPI 104MHZ 8WSON
Part | Technology | Operating Temperature [Max] | Operating Temperature [Min] | Memory Size | Memory Type | Package / Case | Write Cycle Time - Word, Page | Memory Format | Mounting Type | Memory Interface | Supplier Device Package | Voltage - Supply [Min] | Voltage - Supply [Max] | Clock Frequency | Memory Organization | Package / Case [y] | Package / Case [x] |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics W25X10CLZPIG | FLASH | 85 °C | -40 °C | 1 Mbit | Non-Volatile | 8-WDFN Exposed Pad | 800 µs | FLASH | Surface Mount | SPI | 8-WSON (6x5) | 2.3 V | 3.6 V | 104 MHz | 128K x 8 | ||
Winbond Electronics W25X10CLSNIG TR | FLASH | 85 °C | -40 °C | 1 Mbit | Non-Volatile | 8-SOIC | 800 µs | FLASH | Surface Mount | SPI | 8-SOIC | 2.3 V | 3.6 V | 104 MHz | 128K x 8 | 3.9 mm | 0.154 in |
Winbond Electronics W25X10VSNIG | FLASH | 85 °C | -40 °C | 1 Mbit | Non-Volatile | 8-SOIC | 3 ms | FLASH | Surface Mount | SPI | 8-SOIC | 2.7 V | 3.6 V | 75 MHz | 128K x 8 | 3.9 mm | 0.154 in |
Winbond Electronics W25X10BVSNIG | FLASH | 85 °C | -40 °C | 1 Mbit | Non-Volatile | 8-SOIC | 3 ms | FLASH | Surface Mount | SPI | 8-SOIC | 2.7 V | 3.6 V | 104 MHz | 128K x 8 | 3.9 mm | 0.154 in |
Winbond Electronics W25X10CLSNIG | FLASH | 85 °C | -40 °C | 1 Mbit | Non-Volatile | 8-SOIC | 800 µs | FLASH | Surface Mount | SPI | 8-SOIC | 2.3 V | 3.6 V | 104 MHz | 128K x 8 | 3.9 mm | 0.154 in |
Winbond Electronics W25X10VZPIG | FLASH | 85 °C | -40 °C | 1 Mbit | Non-Volatile | 8-WDFN Exposed Pad | 3 ms | FLASH | Surface Mount | SPI | 8-WSON (6x5) | 2.7 V | 3.6 V | 75 MHz | 128K x 8 | ||
Winbond Electronics W25X10CLZPIG TR | FLASH | 85 °C | -40 °C | 1 Mbit | Non-Volatile | 8-WDFN Exposed Pad | 800 µs | FLASH | Surface Mount | SPI | 8-WSON (6x5) | 2.3 V | 3.6 V | 104 MHz | 128K x 8 | ||
Winbond Electronics W25X10AVSNIG | FLASH | 85 °C | -40 °C | 1 Mbit | Non-Volatile | 8-SOIC | 3 ms | FLASH | Surface Mount | SPI | 8-SOIC | 2.7 V | 3.6 V | 100 MHz | 128K x 8 | 3.9 mm | 0.154 in |
Winbond Electronics W25X10BVZPIG | FLASH | 85 °C | -40 °C | 1 Mbit | Non-Volatile | 8-WDFN Exposed Pad | 3 ms | FLASH | Surface Mount | SPI | 8-WSON (6x5) | 2.7 V | 3.6 V | 104 MHz | 128K x 8 | ||
Winbond Electronics W25X10CLUXIG TR | FLASH | 85 °C | -40 °C | 1 Mbit | Non-Volatile | 8-UFDFN Exposed Pad | 800 µs | FLASH | Surface Mount | SPI | 8-USON (2x3) | 2.3 V | 3.6 V | 104 MHz | 128K x 8 | ||
Winbond Electronics W25X10VSNIG T&R | FLASH | 85 °C | -40 °C | 1 Mbit | Non-Volatile | 8-SOIC | 3 ms | FLASH | Surface Mount | SPI | 8-SOIC | 2.7 V | 3.6 V | 75 MHz | 128K x 8 | 3.9 mm | 0.154 in |