RCX081N20
ActiveRohm Semiconductor
MOSFET N-CH 200V 8A TO220FM
RCX081N20
ActiveRohm Semiconductor
MOSFET N-CH 200V 8A TO220FM
Description
General part information
RCX081N20 Series
10V Drive Nch Power MOSFET
Technical Specifications
Parameters and characteristics for this part
| Specification | RCX081N20 |
|---|---|
| Current - Continuous Drain (Id) (Tc) | 8 A |
| Drain to Source Voltage (Vdss) | 200 V |
| Drive Voltage (Max Rds On, Min Rds On) | 10 V |
| FET Type | N-Channel |
| Gate Charge (Max) | 8.5 nC |
| Input Capacitance (Ciss) (Max) | 330 pF |
| Mounting Type | Through Hole |
| Operating Temperature | 150 °C |
| Package / Case | TO-220-3 Full Pack |
| Package Name | TO-220FM |
| Power Dissipation (Max) | 40 W, 2.23 W |
| Rds On (Max) | 770 mOhm |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 30 V |
| Vgs(th) (Max) | 5.25 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
TO-220FM Part Marking
Transistor, MOSFET Flammability
TO220FM Inner Structure
MOSFET Gate Resistor Setting for Motor Driving
Precautions When Measuring the Rear of the Package with a Thermocouple
What is a Thermal Model? (Transistor)
Anti-Whisker formation - Transistors
Temperature derating method for Safe Operating Area (SOA)
MOSFET Gate Drive Current Setting for Motor Driving
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Method for Monitoring Switching Waveform
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Moisture Sensitivity Level - Transistors
Importance of Probe Calibration When Measuring Power: Deskew
Compliance of the RoHS directive
What Is Thermal Design
List of Transistor Package Thermal Resistance
Notes for Temperature Measurement Using Thermocouples
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Basics of Thermal Resistance and Heat Dissipation
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Reliability Test Result
How to Create Symbols for PSpice Models
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
Types and Features of Transistors
Measurement Method and Usage of Thermal Resistance RthJC
Power Eco Family: Overview of ROHM's Power Semiconductor Lineup
Notes for Temperature Measurement Using Forward Voltage of PN Junction
ESD Data
RCX081N20 Data Sheet
PCB Layout Thermal Design Guide
Calculation of Power Dissipation in Switching Circuit
How to Use LTspice® Models: Tips for Improving Convergence
How to Use LTspice® Models
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Package Dimensions
Part Explanation
Two-Resistor Model for Thermal Simulation
Impedance Characteristics of Bypass Capacitor
Judgment Criteria of Thermal Evaluation
Notes for Calculating Power Consumption:Static Operation
About Export Regulations