IPLK70R2K0P7ATMA1

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Infineon Technologies

THE COOLMOS™ P7 SUPERJUNCTION MOSFET IPLK70R2K0P7 ADDRESSES CHALLENGES IN THE LOW-POWER SMPS MARKET, BY OFFERING EXCELLENT PERFORMANCE AND EASE-OF-USE.

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DocumentsDatasheet Technical Data Sheet EN

IPLK70R2K0P7ATMA1

Active

Infineon Technologies

THE COOLMOS™ P7 SUPERJUNCTION MOSFET IPLK70R2K0P7 ADDRESSES CHALLENGES IN THE LOW-POWER SMPS MARKET, BY OFFERING EXCELLENT PERFORMANCE AND EASE-OF-USE.

Deep-Dive with AI

DocumentsDatasheet Technical Data Sheet EN

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	IPLK70R2K0P7ATMA1

Drain to Source Voltage (Vdss)	700 V
FET Type	N-Channel
Mounting Type	Surface Mount
Package / Case	8-PowerTDFN
Supplier Device Package	PG-TDSON-8
Technology	MOSFET (Metal Oxide)

IPLK70 Series

Part	Mounting Type	Package / Case	Technology	Supplier Device Package	Drain to Source Voltage (Vdss)	FET Type
Infineon Technologies IPLK70R900P7ATMA1	Surface Mount	8-PowerTDFN	MOSFET (Metal Oxide)	PG-TDSON-8	700 V	N-Channel
Infineon Technologies IPLK70R2K0P7ATMA1	Surface Mount	8-PowerTDFN	MOSFET (Metal Oxide)	PG-TDSON-8	700 V	N-Channel
Infineon Technologies IPLK70R1K2P7ATMA1	Surface Mount	8-PowerTDFN	MOSFET (Metal Oxide)	PG-TDSON-8	700 V	N-Channel
Infineon Technologies IPLK70R750P7ATMA1	Surface Mount	8-PowerTDFN	MOSFET (Metal Oxide)	PG-TDSON-8	700 V	N-Channel

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 0.84
		10	$ 0.69
		100	$ 0.54
		500	$ 0.45
		1000	$ 0.37
		2000	$ 0.35
	Digi-Reel®	1	$ 0.84
		10	$ 0.69
		100	$ 0.54
		500	$ 0.45
		1000	$ 0.37
		2000	$ 0.35
	Tape & Reel (TR)	5000	$ 0.34
		10000	$ 0.32
		15000	$ 0.32
Newark	Each (Supplied on Cut Tape)	1	$ 1.38

Description

General part information

IPLK70 Series

TheCoolMOS™ P7superjunction (SJ) MOSFET family is designed to address typical challenges in the low-power SMPS market, by offering excellent performance and ease-of-use, enabling improved form factors and price competitiveness. The Thin-PAK 5x6 package is characterized by a very small footprint of 5x6 mm² and a very low profile with a height of 1 mm. Together with its benchmark low parasitics, these features lead to significantly smaller form factors and help to boost power density. This combination makesCoolMOS™ P7 in Thin-PAKa perfect fit for its target applications. The 700 V CoolMOS™ P7 family is optimized for flyback topologies.