
BU7445HFV-TR
ActiveRohm Semiconductor
LOW POWER GROUND SENSE OPERATIONAL AMPLIFIER

BU7445HFV-TR
ActiveRohm Semiconductor
LOW POWER GROUND SENSE OPERATIONAL AMPLIFIER
Description
General part information
BU7445 Series
Low Voltage CMOS Op-Amp integrates one or two independent outputs full swing Op-Amps and phase compensation capacitors on a single chip. Especially, this series is operable with low voltage, low supply current and low input bias current.
Technical Specifications
Parameters and characteristics for this part
| Specification | BU7445HFV-TR |
|---|---|
| Amplifier Type | General Purpose |
| Current - Input Bias | 1 pA |
| Current - Output / Channel | 18 mA |
| Current - Supply | 40 µA |
| Gain Bandwidth Product | 400 kHz |
| Mounting Type | Surface Mount |
| Number of Circuits | 1 |
| Operating Temperature (Max) | 85 °C |
| Operating Temperature (Min) | -40 °C |
| Output Type | Rail-to-Rail |
| Package / Case | SOT-665 |
| Package Name | 5-HVSOF |
| Slew Rate | 0.25 V/µs |
| Voltage - Input Offset | 1 mV |
| Voltage - Supply Span (Max) | 5.5 V |
| Voltage - Supply Span (Min) | 1.7 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
HVSOF5 Taping Spec
BU7445HFV-TR Flammability
Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package
Compliance with the ELV directive
Thermal Resistance
Op amp Circuit Collection
Anti-Whisker formation
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
What Is Thermal Design
Op-Amp / Comparator Tutorial
Design Guide and Example of Stencil for Exposed Pad
Factory Information
Basics of Thermal Resistance and Heat Dissipation
Low-Side Current Sensing Circuit Design
Solder Joint Rate and Thermal Resistance of Exposed Pad
Five Steps for Successful Thermal Design of IC
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Impedance Characteristics of Bypass Capacitor