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Product schematic image

DTB114GKT146

Active
Rohm Semiconductor

PNP, SOT-346, R2 ALONE TYPE DIGITAL TRANSISTOR (BIAS RESISTOR BUILT-IN TRANSISTOR)

Product schematic image

DTB114GKT146

Active
Rohm Semiconductor

PNP, SOT-346, R2 ALONE TYPE DIGITAL TRANSISTOR (BIAS RESISTOR BUILT-IN TRANSISTOR)

Description

General part information

DTB114 Series

These are the standard products of "digital transistors" which ROHM invented and marketed first in the world.

Technical Specifications

Parameters and characteristics for this part

SpecificationDTB114GKT146
Current - Collector (Ic) (Max)500 mA
Current - Collector Cutoff (Max)500 nA
DC Current Gain (hFE) (Min)56
Frequency - Transition200 MHz
Mounting TypeSurface Mount
Package / CaseTO-236-3, SOT-23-3, SC-59
Package NameSMT3
Power - Max200 mW
Resistor - Emitter Base (R2)10 kOhms
Transistor TypePre-Biased, PNP
Vce Saturation (Max)300 mV
Voltage - Collector Emitter Breakdown (Max)50 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Datasheet
Explanation for Marking
About Export Regulations
Part Explanation
Moisture Sensitivity Level - Transistors
Anti-Whisker formation - Transistors
Inner Structure
Two-Resistor Model for Thermal Simulation
Notes for Temperature Measurement Using Thermocouples
Types and Features of Transistors
Precautions When Measuring the Rear of the Package with a Thermocouple
How to Use LTspice® Models: Tips for Improving Convergence
Basics of Thermal Resistance and Heat Dissipation
Reliability Test Result
Condition of Soldering / Land Pattern Reference
Certificate of not containing SVHC under REACH Regulation
List of Transistor Package Thermal Resistance
Temperature derating method for Safe Operating Area (SOA)
PCB Layout Thermal Design Guide
What Is Thermal Design
About Flammability of Materials
What is a Thermal Model? (Transistor)
How to Create Symbols for PSpice Models
Taping Information
Calculation of Power Dissipation in Switching Circuit
Impedance Characteristics of Bypass Capacitor
Importance of Probe Calibration When Measuring Power: Deskew
Package Dimensions
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
ESD Data
Method for Monitoring Switching Waveform
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
How to Use LTspice® Models
Notes for Calculating Power Consumption:Static Operation
Measurement Method and Usage of Thermal Resistance RthJC
Compliance of the RoHS directive
Notes for Temperature Measurement Using Forward Voltage of PN Junction