04-1518-10

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Aries Electronics

CONN IC DIP SOCKET 4POS GOLD

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04-1518-10

Active

Aries Electronics

CONN IC DIP SOCKET 4POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1000	$ 0.40

Description

General part information

04-1518 Series

4 (2 x 2) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources

Datasheet

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	04-1518-10	04-1518 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Tin	Gold, Tin
Contact Finish Thickness - Mating	10 çin	10 çin
Contact Finish Thickness - Mating	0.25 çm	0.25 çm
Contact Finish Thickness - Post	200 µin	10 - 200 çin
Contact Finish Thickness - Post	5.08 µm	0.25 - 5.08 çm
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post [custom]	Brass	Brass
Current Rating (Amps)	3 A	3 A
Features	Open Frame	Open Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole
Number of Positions or Pins (Grid) [custom]	4	4
Pitch - Mating	0.1 in	0.1 in
Pitch - Mating	2.54 mm	2.54 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Solder	Solder
Termination Post Length	3.18 mm	3.18 mm
Termination Post Length	0.125 in	0.125 in
Type	DIP	DIP
Type	5.08 mm	5.08 mm
Type	0.2 in	0.2 in

04-1518 Series

CONN IC DIP SOCKET 4POS GOLD

Part	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Mounting Type	Current Rating (Amps)	Housing Material	Number of Positions or Pins (Grid) [custom]	Termination Post Length	Termination Post Length	Contact Finish - Mating	Type	Type	Type	Termination	Pitch - Post	Pitch - Post	Features	Material Flammability Rating	Contact Material - Post [custom]	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating
Aries Electronics 04-1518-11H	10 çin	0.25 çm	Beryllium Copper	Through Hole	3 A	Glass Filled, Nylon 4/6, Polyamide (PA46)	4	3.18 mm	0.125 in	Gold	DIP	5.08 mm	0.2 in	Solder	2.54 mm	0.1 in	Open Frame	UL94 V-0	Brass	Gold	10 çin	0.25 çm	0.1 in	2.54 mm
Aries Electronics 04-1518-10T	200 µin	5.08 µm	Beryllium Copper	Through Hole	3 A	Glass Filled, Nylon 4/6, Polyamide (PA46)	4	3.18 mm	0.125 in	Gold	DIP	5.08 mm	0.2 in	Solder	2.54 mm	0.1 in	Open Frame	UL94 V-0	Brass	Tin	10 çin	0.25 çm	0.1 in	2.54 mm
Aries Electronics 04-1518-10	200 µin	5.08 µm	Beryllium Copper	Through Hole	3 A	Glass Filled, Nylon 4/6, Polyamide (PA46)	4	3.18 mm	0.125 in	Gold	DIP	5.08 mm	0.2 in	Solder	2.54 mm	0.1 in	Open Frame	UL94 V-0	Brass	Tin	10 çin	0.25 çm	0.1 in	2.54 mm
Aries Electronics 04-1518-10H	200 µin	5.08 µm	Beryllium Copper	Through Hole	3 A	Glass Filled, Nylon 4/6, Polyamide (PA46)	4	3.18 mm	0.125 in	Gold	DIP	5.08 mm	0.2 in	Solder	2.54 mm	0.1 in	Open Frame	UL94 V-0	Brass	Tin	10 çin	0.25 çm	0.1 in	2.54 mm
Aries Electronics 04-1518-11	10 çin	0.25 çm	Beryllium Copper	Through Hole	3 A	Glass Filled, Nylon 4/6, Polyamide (PA46)	4	3.18 mm	0.125 in	Gold	DIP	5.08 mm	0.2 in	Solder	2.54 mm	0.1 in	Open Frame	UL94 V-0	Brass	Gold	10 çin	0.25 çm	0.1 in	2.54 mm