BD37533FV-E2
ActiveRohm Semiconductor
SOUND PROCESSORS WITH BUILT-IN 3-BAND EQUALIZERS
BD37533FV-E2
ActiveRohm Semiconductor
SOUND PROCESSORS WITH BUILT-IN 3-BAND EQUALIZERS
Description
General part information
BD37533FV Series
This series supports common control software, increasing design and development efficiency. Tone quality can be adjusted by parametric equalizer using no external components. The built-in three-band equalizer sub woofer output allows for a space saving design.
Technical Specifications
Parameters and characteristics for this part
| Specification | BD37533FV-E2 |
|---|---|
| Applications | Audio |
| Function | Audio Tone Processor |
| Grade | Automotive |
| Interface | I2C |
| Mounting Type | Surface Mount |
| Number of Channels | 5 |
| Operating Temperature (Max) | 85 °C |
| Operating Temperature (Min) | -40 °C |
| Package Length | 0.22 " |
| Package Name | 28-SSOP-B, 28-LSSOP |
| Package Width | 5.6 mm |
| Voltage - Supply (Maximum) | 9.5 V |
| Voltage - Supply (Minimum) | 7 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
SSOP-B28 Taping Spec
BD37533FV-E2 Flammability
What Is Thermal Design
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Five Steps for Successful Thermal Design of IC
PCB Layout Thermal Design Guide
Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package
Impedance Characteristics of Bypass Capacitor
Thermal Resistance
Basics of Thermal Resistance and Heat Dissipation
Factory Information
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Solder Joint Rate and Thermal Resistance of Exposed Pad
Judgment Criteria of Thermal Evaluation
Design Guide and Example of Stencil for Exposed Pad
Compliance with the ELV directive
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Anti-Whisker formation
θ<sub>JA</sub> and Ψ<sub>JT</sub>
How to Use the Thermal Resistance and Thermal Characteristics Parameters