BR25G1MFVT-5AE2
ActiveRohm Semiconductor
EEPROM, 1MBIT, 20MHZ, SPI, TSSOP-B8 ROHS COMPLIANT: YES
BR25G1MFVT-5AE2
ActiveRohm Semiconductor
EEPROM, 1MBIT, 20MHZ, SPI, TSSOP-B8 ROHS COMPLIANT: YES
Description
General part information
BR25G1 Series
BR25G1MFVT-5A is a 1Mbit Serial EEPROM of SPI BUS Interface.
Technical Specifications
Parameters and characteristics for this part
| Specification | BR25G1MFVT-5AE2 |
|---|---|
| Clock Frequency | 20 MHz |
| Memory Depth | 128 K |
| Memory Format | EEPROM |
| Memory Interface (Type) | SPI |
| Memory Size | 1 Mbit |
| Memory Type | Non-Volatile |
| Memory Width | 8 bit |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 85 °C |
| Operating Temperature (Min) | -40 °C |
| Package Length | 0.173 in |
| Package Name | 8-TSSOP-B, 8-TSSOP |
| Package Width | 4.4 mm |
| Technology | EEPROM |
| Voltage - Supply (Maximum) | 5.5 V |
| Voltage - Supply (Minimum) | 1.6 V |
| Write Cycle Time - Page | 3.5 ms |
| Write Cycle Time - Word | 3.5 ms |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
What Is Thermal Design
Impedance Characteristics of Bypass Capacitor
Thermal Resistance
Design Guide and Example of Stencil for Exposed Pad
Five Steps for Successful Thermal Design of IC
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Solder Joint Rate and Thermal Resistance of Exposed Pad
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package
BR25G1MFVT-5A Data Sheet
Basics of Thermal Resistance and Heat Dissipation
Factory Information
TSSOP-B8 Package Information
Opcode, Address, and Page Configuration for SPI BUS EEPROM
