PH3N-50.8-12.7-0.062-1A

Obsolete

t-Global Technology

PH3N NANO 50.8X12.07X0.062MM

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Obsolete

t-Global Technology

PH3N NANO 50.8X12.07X0.062MM

Technical Specifications

Parameters and characteristics for this part

Part	Shape	Fin Height [z]	Fin Height [z]	Material	Shelf Life	Type	Length	Length	Package Cooled	Attachment Method	Material Finish	Fin Height	Fin Height
t-Global Technology PH3N-50.8-12.7-0.07-1A	Rectangular	0.003 in	0.07 mm	Copper	12 Months	Heat Spreader	50.8 mm	2 in	ASIC BGA CPU LGA	Adhesive	Polyester
t-Global Technology PH3N-50.8-12.7-0.062-1A	Rectangular			Copper	12 Months	Heat Spreader	50.8 mm	2 in	ASIC BGA CPU LGA	Adhesive	Polyester	0.002 in	0.06 mm

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

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General part information

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader

Technical documentation and resources