RB225T-60NZC9
ActiveRohm Semiconductor
60V, 30A, ITO-220AB, SCHOTTKY BARRIER DIODE
RB225T-60NZC9
ActiveRohm Semiconductor
60V, 30A, ITO-220AB, SCHOTTKY BARRIER DIODE
Description
General part information
RB225T-60NZ Series
Diode Array 1 Pair Common Cathode 60 V 30A Through Hole TO-220-3 Full Pack
Technical Specifications
Parameters and characteristics for this part
| Specification | RB225T-60NZC9 |
|---|---|
| Current - Average Rectified (Io) (per Diode) | 30 A |
| Current - Reverse Leakage | 600 µA |
| Diode Configuration | Common Cathode |
| Diode Pair Count | 1 pair |
| Mounting Type | Through Hole |
| Operating Temperature - Junction | 150 °C |
| Package / Case | TO-220-3 Full Pack |
| Package Name | TO-220FN |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 60 V |
| Voltage - Forward (Vf) (Max) | 630 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Importance of Probe Calibration When Measuring Power: Deskew
Compliance of the RoHS directive
Notes for Temperature Measurement Using Thermocouples
PCB Layout Thermal Design Guide
Absolute Maximum Rating and Electrical Characteristics of Diodes
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
What is a Thermal Model? (Diode)
Moisture Sensitivity Level - Diodes
Notes for Calculating Power Consumption:Static Operation
ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment
How to Create Symbols for PSpice Models
Certificate of not containing SVHC under REACH Regulation
How to Select Reverse Current Protection Diodes for LDO Regulators
Basics of Thermal Resistance and Heat Dissipation
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Diode Selection Method for Asynchronous Converter
Notes for Temperature Measurement Using Forward Voltage of PN Junction
What Is Thermal Design
Reliability Test Result
How to Use LTspice® Models: Tips for Improving Convergence
Explanation for Marking
Condition of Soldering / Land Pattern Reference
Power Loss and Thermal Design of Diodes
How to Select Rectifier Diodes
θ<sub>JA</sub> and Ψ<sub>JT</sub>
How to Use LTspice® Models
Precautions When Measuring the Rear of the Package with a Thermocouple
How to Use the Thermal Resistance and Thermal Characteristics Parameters
RB225T-60NZ ESD Data
RB225T-60NZ Data Sheet
Anti-Whisker formation - Diodes
Judgment Criteria of Thermal Evaluation
Two-Resistor Model for Thermal Simulation
Method for Monitoring Switching Waveform
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
Diode Types and Applications
Inner Structure
About Export Regulations
θ<sub>JC</sub> and Ψ<sub>JT</sub>
List of Diode Package Thermal Resistance
Taping Information
About Flammability of Materials
Measurement Method and Usage of Thermal Resistance RthJC
Impedance Characteristics of Bypass Capacitor
Package Dimensions
Part Explanation