240-1280-29-0602J
Active3M (TC)
IC & COMPONENT SOCKET, 40 CONTACTS, DIP SOCKET, 2.54 MM, 15.24 MM, BERYLLIUM COPPER
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240-1280-29-0602J
Active3M (TC)
IC & COMPONENT SOCKET, 40 CONTACTS, DIP SOCKET, 2.54 MM, 15.24 MM, BERYLLIUM COPPER
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Technical Specifications
Parameters and characteristics for this part
| Specification | 240-1280-29-0602J |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 30 Áin |
| Contact Finish Thickness - Mating | 0.76 Ám |
| Contact Finish Thickness - Post | 30 µin |
| Contact Finish Thickness - Post | 0.76 µm |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Convert From (Adapter End) | 15.24 mm |
| Convert From (Adapter End) | DIP |
| Convert From (Adapter End) | 0.6 in |
| Convert To (Adapter End) | 0.6 in |
| Convert To (Adapter End) | DIP |
| Convert To (Adapter End) | 15.24 mm |
| Current Rating (Amps) | 1 A |
| Features | Closed Frame |
| Housing Material | Polysulfone (PSU), Glass Filled |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Pins | 40 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Pitch - Mating | 0.1 in |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 2.54 mm |
| Pitch - Post | 0.1 in |
| Termination | Solder |
| Termination Post Length | 3.3 mm |
| Termination Post Length | 0.13 in |
240 Series
| Part | Mounting Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Mating | Features | Contact Finish - Post | Contact Material - Post | Pitch - Post | Pitch - Post | Housing Material | Type | Type | Type | Contact Resistance | Material Flammability Rating | Contact Material - Mating | Termination | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Current Rating (Amps) | Termination Post Length | Termination Post Length | Operating Temperature [Min] | Operating Temperature [Max] | Number of Pins | Termination Post Length [x] | Termination Post Length [x] | Convert To (Adapter End) | Convert To (Adapter End) | Convert To (Adapter End) | Convert From (Adapter End) | Convert From (Adapter End) | Convert From (Adapter End) | Number of Positions or Pins (Grid) [custom] | Convert To (Adapter End) | Convert From (Adapter End) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
3M (TC) | Connector | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 30 µin | 0.76 µm | Gold | Closed Frame | Gold | Beryllium Copper | 2.54 mm | 0.1 in | Polysulfone (PSU) Glass Filled | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | 15 mOhm | UL94 V-0 | Beryllium Copper | Press-Fit | 40 | 20 | 2 | 1 A | 0.11 in | 2.78 mm | -55 °C | 125 °C | ||||||||||||
3M (TC) | Through Hole | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 30 µin | 0.76 µm | Gold | Closed Frame | Gold | Beryllium Copper | 2.54 mm | 0.1 in | Polysulfone (PSU) Glass Filled | UL94 V-0 | Beryllium Copper | Wire Wrap | 1 A | -55 °C | 125 °C | 40 | 0.62 in | 15.75 mm | 0.6 in | DIP | 15.24 mm | 15.24 mm | DIP | 0.6 in | ||||||||||||
3M (TC) | Through Hole | Gold | Closed Frame | Gold | Beryllium Copper | Polyethersulfone (PES) | QFN | 25 mOhm | Beryllium Copper | Solder | 10 | 4 | 0.118 in | 3 mm | 40 | ||||||||||||||||||||||||||
3M (TC) | Through Hole | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 30 µin | 0.76 µm | Gold | Closed Frame | Gold | Beryllium Copper | 2.54 mm | 0.1 in | Polysulfone (PSU) Glass Filled | UL94 V-0 | Beryllium Copper | Solder | 1 A | 0.13 in | 3.3 mm | -55 °C | 125 °C | 40 | 0.6 in | DIP | 15.24 mm | 15.24 mm | DIP | 0.6 in | ||||||||||||
3M (TC) | Through Hole | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 30 µin | 0.76 µm | Gold | Closed Frame | Gold | Beryllium Copper | 2.54 mm | 0.1 in | Polysulfone (PSU) Glass Filled | UL94 V-0 | Beryllium Copper | Wire Wrap | 1 A | -55 °C | 125 °C | 40 | 0.62 in | 15.75 mm | DIP | 1 " | DIP | 25.4 mm | 25.4 mm | 1 in | ||||||||||||
3M (TC) | Through Hole | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 30 µin | 0.76 µm | Gold | Gold | Beryllium Copper | 2.54 mm | 0.1 in | Polysulfone (PSU) Glass Filled | UL94 V-0 | Beryllium Copper | Solder | 1 A | 0.13 in | 3.3 mm | -55 °C | 125 °C | 40 | 0.6 in | DIP | 15.24 mm | 15.24 mm | DIP | 0.6 in |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
240 Series
IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
Documents
Technical documentation and resources