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100-016-051

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3M

CONN IC DIP SOCKET 16POS GOLD

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100-016-051

Active
3M

CONN IC DIP SOCKET 16POS GOLD

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

Specification100-016-051
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating0.203 Ám
Contact Finish Thickness - Mating8 Áin
Contact Finish Thickness - PostFlash
Contact Material - MatingBeryllium Copper
Contact Material - Post [custom]Brass
Current Rating (Amps)1 A
FeaturesSeal Tape, Closed Frame
Housing MaterialPolyphenylene Sulfide (PPS), Glass Filled
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)16
Operating Temperature [Max]125 °C
Operating Temperature [Min]-65 ░C
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Pitch - Post2.54 mm
Pitch - Post0.1 in
TerminationSolder
Termination Post Length3.2 mm
Termination Post Length0.126 in
Type0.3 "
Type7.62 mm
TypeDIP

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$

100-016 Series

CONN IC DIP SOCKET 16POS GOLD

PartContact Finish - MatingFeaturesTerminationContact Finish - PostHousing MaterialCurrent Rating (Amps)Contact Material - MatingOperating Temperature [Max]Operating Temperature [Min]Contact Finish Thickness - MatingContact Finish Thickness - MatingNumber of Positions or Pins (Grid)Contact Material - Post [custom]Mounting TypePitch - MatingPitch - MatingMaterial Flammability RatingPitch - PostPitch - PostTypeTypeTypeTermination Post LengthTermination Post LengthContact Finish Thickness - Post
Gold
Closed Frame, Seal Tape
Solder
Gold
Polyphenylene Sulfide (PPS), Glass Filled
1 A
Beryllium Copper
125 °C
-65 ░C
0.203 Ám
8 Áin
16
Brass
Through Hole
0.1 in
2.54 mm
UL94 V-0
2.54 mm
0.1 in
0.3 "
7.62 mm
DIP
3.2 mm
0.126 in
Flash

Description

General part information

100-016 Series

16 (2 x 8) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources

No documents available