
BD6971FV-E2
ActiveRohm Semiconductor
LOW VOLTAGE START-UP, QUIET DRIVER, SMALL PACKAGE TYPE

BD6971FV-E2
ActiveRohm Semiconductor
LOW VOLTAGE START-UP, QUIET DRIVER, SMALL PACKAGE TYPE
Description
General part information
BD6971FV Series
This series is able to change the rotational speed of the motor by external PWM input signal and DC voltage. This IC includes output power transistors.
Technical Specifications
Parameters and characteristics for this part
| Specification | BD6971FV-E2 |
|---|---|
| Applications | Fan Motor Driver |
| Current - Output | 1 A |
| Function | Control and Power Stage, Driver - Fully Integrated |
| Half-Bridge Count | 2 |
| Interface | PWM |
| Motor Type - AC, DC | Brushless DC (BLDC) |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 100 °C |
| Operating Temperature (Min) | -40 °C |
| Output Configuration | Half Bridge |
| Package Length | 0.173 in |
| Package Name | 14-LSSOP, 14-SSOP-B |
| Package Width | 4.4 mm |
| Technology | Power MOSFET |
| Voltage - Load | 20 V |
| Voltage - Supply (Maximum) | 17 V |
| Voltage - Supply (Minimum) | 3.5 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Technical Data Sheet EN
Design Guide and Example of Stencil for Exposed Pad
Impedance Characteristics of Bypass Capacitor
Solder Joint Rate and Thermal Resistance of Exposed Pad
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
How to Use the Thermal Resistance and Thermal Characteristics Parameters
UL94 Flame Classifications of Mold Compound
Judgment Criteria of Thermal Evaluation
Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package
Thermal Resistance
Precautions When Measuring the Rear of the Package with a Thermocouple
SSOP-B14 Package Information
What Is Thermal Design
Factory Information
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Anti-Whisker formation
Compliance with the ELV directive
Basics of Thermal Resistance and Heat Dissipation
PCB Layout Thermal Design Guide
Five Steps for Successful Thermal Design of IC
Two-Resistor Model for Thermal Simulation
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)