HMTSW-111-07-F-D-120-RA

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Samtec Inc.

CONN HEADER R/A 22POS 2.54MM

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HMTSW-111-07-F-D-120-RA

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Samtec Inc.

CONN HEADER R/A 22POS 2.54MM

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Technical Specifications

Parameters and characteristics for this part

Specification	HMTSW-111-07-F-D-120-RA

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	3 µin
Contact Finish Thickness - Mating	0.076 µm
Contact Length - Mating	3.05 mm
Contact Length - Mating	0.12 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Amps)	3 A
Fastening Type	Push-Pull
Insulation Color	Natural
Insulation Height	0.24 in
Insulation Height	6.1 mm
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole, Right Angle
Number of Positions	22 positions
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Row Spacing - Mating [x]	2.54 mm
Row Spacing - Mating [x]	0.1 in
Shrouding	Unshrouded
Style	Board to Board, Cable
Termination	Solder

HMTSW-111 Series

Part	Contact Type	Insulation Color	Mounting Type	Current Rating (Amps)	Connector Type	Shrouding	Insulation Height	Insulation Height	Number of Rows	Number of Positions Loaded	Material Flammability Rating	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Contact Shape	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Termination	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Fastening Type	Operating Temperature [Min]	Operating Temperature [Max]	Style	Contact Material	Insulation Material	Contact Length - Mating	Contact Length - Mating	Number of Positions	Contact Length - Post	Contact Length - Post	Overall Contact Length	Overall Contact Length	Contact Length - Mating [x]	Contact Length - Mating [x]	Number of Positions Loaded	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Length - Post [x]	Contact Length - Post [x]
Samtec Inc. HMTSW-111-07-S-D-130-RA	Male Pin	Natural	Through Hole Right Angle	3 A	Header	Unshrouded	0.24 in	6.1 mm	2	All	UL94 V-0	0.1 in	2.54 mm	Gold	Square	30 Áin	0.76 Ám	Tin	Solder	2.54 mm	0.1 in	Push-Pull	-55 °C	125 °C	Board to Board Cable	Phosphor Bronze	Liquid Crystal Polymer (LCP)	0.13 in	3.3 mm	22 positions
Samtec Inc. HMTSW-111-07-S-D-240	Male Pin	Natural	Through Hole	3 A	Header	Unshrouded	0.1 in	2.54 mm	2	All	UL94 V-0	0.1 in	2.54 mm	Gold	Square	30 Áin	0.76 Ám	Tin	Solder	2.54 mm	0.1 in	Push-Pull	-55 °C	125 °C	Board to Board Cable	Phosphor Bronze	Liquid Crystal Polymer (LCP)		6.1 mm	22 positions	0.09 "	2.29 mm	0.43 in	10.92 mm	0.24 in
Samtec Inc. HMTSW-111-09-LM-D-500	Male Pin	Natural	Through Hole	3 A	Header	Unshrouded	0.1 in	2.54 mm	2	All	UL94 V-0	0.1 in	2.54 mm	Gold	Square	10 çin	0.25 çm	Tin	Solder	2.54 mm	0.1 in	Push-Pull	-55 °C	125 °C	Board to Board Cable	Phosphor Bronze	Liquid Crystal Polymer (LCP)			22 positions	0.13 in	3.3 mm	0.73 in	18.54 mm	0.5 in	12.7 mm
Samtec Inc. HMTSW-111-23-T-S-135-RA-003	Male Pin	Natural	Through Hole Right Angle	3 A	Header	Unshrouded	0.122 in	3.1 mm	1		UL94 V-0	0.1 in	2.54 mm		Square			Tin	Solder			Push-Pull	-55 °C	105 ░C	Board to Board Cable	Phosphor Bronze	Liquid Crystal Polymer (LCP)	0.135 in	3.43 mm	11							10
Samtec Inc. HMTSW-111-23-T-S-130-NA	Male Pin	Natural	Through Hole Right Angle	3 A	Header	Unshrouded	0.122 in	3.1 mm	1	All	UL94 V-0	0.1 in	2.54 mm		Square			Tin	Solder			Push-Pull	-55 °C	105 ░C	Board to Board Cable	Phosphor Bronze	Liquid Crystal Polymer (LCP)	0.13 in	3.3 mm	11
Samtec Inc. HMTSW-111-10-G-D-365-012	Male Pin	Natural	Through Hole	3 A	Header	Unshrouded	0.1 in	2.54 mm	2		UL94 V-0	0.1 in	2.54 mm	Gold	Square	10 çin	0.25 çm	Gold	Solder	2.54 mm	0.1 in	Push-Pull	-55 °C	125 °C	Board to Board Cable	Phosphor Bronze	Liquid Crystal Polymer (LCP)			22 positions	0.365 in	9.27 mm	0.83 in	21.08 mm	0.365 in	9.27 mm	21	3 µin	0.076 µm
Samtec Inc. HMTSW-111-09-T-S-110-RE	Male Pin	Natural	Through Hole Right Angle	3 A	Header	Unshrouded	0.122 in	3.1 mm	1	All	UL94 V-0	0.1 in	2.54 mm		Square			Tin	Solder			Push-Pull	-55 °C	105 ░C	Board to Board Cable	Phosphor Bronze	Liquid Crystal Polymer (LCP)	0.11 in	2.79 mm	11
Samtec Inc. HMTSW-111-07-S-S-100-RA	Male Pin	Natural	Through Hole Right Angle	3 A	Header	Unshrouded	0.122 in	3.1 mm	1	All	UL94 V-0	0.1 in	2.54 mm	Gold	Square	30 Áin	0.76 Ám	Tin	Solder			Push-Pull	-55 °C	125 °C	Board to Board Cable	Phosphor Bronze	Liquid Crystal Polymer (LCP)	0.1 in	2.54 mm	11
Samtec Inc. HMTSW-111-09-G-D-009	Male Pin	Natural	Through Hole	3 A	Header	Unshrouded	0.1 in	2.54 mm	2	All	UL94 V-0	0.1 in	2.54 mm	Gold	Square	10 çin	0.25 çm	Gold	Solder	2.54 mm	0.1 in	Push-Pull	-55 °C	125 °C	Board to Board Cable	Phosphor Bronze	Liquid Crystal Polymer (LCP)	0.009 in	0.23 mm	22 positions			0.73 in	18.54 mm				3 µin	0.076 µm	15.77 mm	0.621 in
Samtec Inc. HMTSW-111-07-F-D-120-RA	Male Pin	Natural	Through Hole Right Angle	3 A	Header	Unshrouded	0.24 in	6.1 mm	2	All	UL94 V-0	0.1 in	2.54 mm	Gold	Square	3 µin	0.076 µm	Tin	Solder	2.54 mm	0.1 in	Push-Pull	-55 °C	125 °C	Board to Board Cable	Phosphor Bronze	Liquid Crystal Polymer (LCP)	0.12 in	3.05 mm	22 positions

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 3.82

Description

General part information

HMTSW-111 Series

Connector Header Through Hole, Right Angle 22 position 0.100" (2.54mm)

Documents

Technical documentation and resources