HD6417750RBP200V

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Renesas Electronics Corporation

IC MCU 32BIT ROMLESS 256BGA

HD6417750RBP200V

Active

Renesas Electronics Corporation

IC MCU 32BIT ROMLESS 256BGA

Description Specifications Series Pricing CAD Documents

Description

General part information

HD6417750 Series

SH-4 SuperH® SH7750 Microcontroller IC 32-Bit Single-Core 200MHz ROMless 256-BGA (27x27)

Technical Specifications

Parameters and characteristics for this part

Specification	HD6417750RBP200V

Connectivity	SmartCard, EMI, SCI, EBI, FIFO
Core Configuration	Single-Core
Core Processor	SH-4
Core Size (Bit Width)	32 Bit
Mounting Type	Surface Mount
Number of I/O	28
Operating Temperature (Max)	75 °C
Operating Temperature (Min)	-20 °C
Oscillator Type	External
Package / Case	256-BBGA
Package Length	27 mm
Package Name	256-BGA
Package Width	27 mm
Peripherals	WDT, POR, DMA
Program Memory Type	ROMless
RAM Size Depth	48 K
RAM Size Width	8 bit
Speed	200 MHz
Voltage - Supply (Vcc/Vdd) Maximum	1.6 V
Voltage - Supply (Vcc/Vdd) Minimum	1.35 V

HD6417750 Series

Part	Core Size (Bit Width)	Core Configuration	Peripherals	Number of I/O	Connectivity	Oscillator Type	RAM Size Depth	RAM Size Width	Operating Temperature (Max)	Operating Temperature (Min)	Core Processor	Voltage - Supply (Vcc/Vdd) Maximum	Voltage - Supply (Vcc/Vdd) Minimum	Speed	Program Memory Type	Package / Case	Package Name	Package Width	Package Length	Mounting Type
Renesas Electronics Corporation HD6417750SX167V	32 Bit	Single-Core	DMA POR WDT	28	EBI EMI FIFO SCI SmartCard	External	24 K	8 bit	75 °C	-20 °C	SH-4	2 V	1.6 V	167 MHz	ROMless
Renesas Electronics Corporation HD6417750SVF133V	32 Bit	Single-Core	DMA POR WDT	28	EBI EMI FIFO SCI SmartCard	External	24 K	8 bit	75 °C	-20 °C	SH-4	1.7 V	1.4 V	133 MHz	ROMless	208-BFQFP Exposed Pad	208-HQFP	28 mm	28 mm	Surface Mount
Renesas Electronics Corporation HD6417750SF200V	32 Bit	Single-Core	DMA POR WDT	28	EBI EMI FIFO SCI SmartCard	External	24 K	8 bit	75 °C	-20 °C	SH-4	2.07 V	1.8 V	200 MHz	ROMless	208-BFQFP Exposed Pad	208-HQFP	28 mm	28 mm	Surface Mount
Renesas Electronics Corporation HD6417750X167V	32 Bit	Single-Core	DMA POR WDT	28	EBI EMI FIFO SCI SmartCard	External	24 K	8 bit	75 °C	-20 °C	SH-4	2 V	1.6 V	167 MHz	ROMless
Renesas Electronics Corporation HD6417750BP200MV	32 Bit	Single-Core	DMA POR WDT	28	EBI EMI FIFO SCI SmartCard	External	24 K	8 bit	75 °C	-20 °C	SH-4	1.6 V	1.35 V	200 MHz	ROMless	256-BBGA	256-BGA	27 mm	27 mm	Surface Mount
Renesas Electronics Corporation HD6417750BP200M	32 Bit	Single-Core	DMA POR WDT	28	EBI EMI FIFO SCI SmartCard	External	24 K	8 bit	75 °C	-20 °C	SH-4	1.6 V	1.35 V	200 MHz	ROMless	256-BBGA	256-BGA	27 mm	27 mm	Surface Mount
Renesas Electronics Corporation HD6417750RBP200V	32 Bit	Single-Core	DMA POR WDT	28	EBI EMI FIFO SCI SmartCard	External	48 K	8 bit	75 °C	-20 °C	SH-4	1.6 V	1.35 V	200 MHz	ROMless	256-BBGA	256-BGA	27 mm	27 mm	Surface Mount
Renesas Electronics Corporation HD6417750SX200V	32 Bit	Single-Core	DMA POR WDT	28	EBI EMI FIFO SCI SmartCard	External	24 K	8 bit	75 °C	-20 °C	SH-4	2.07 V	1.8 V	200 MHz	ROMless
Renesas Electronics Corporation HD6417750RX200V	32 Bit	Single-Core	DMA POR WDT	28	EBI EMI FIFO SCI SmartCard	External	48 K	8 bit	75 °C	-20 °C	SH-4	1.6 V	1.35 V	200 MHz	ROMless
Renesas Electronics Corporation HD6417750F167	32 Bit	Single-Core	DMA POR WDT	28	EBI EMI FIFO SCI SmartCard	External	24 K	8 bit	75 °C	-20 °C	SH-4	2 V	1.6 V	167 MHz	ROMless	208-BFQFP Exposed Pad	208-HQFP	28 mm	28 mm	Surface Mount

Pricing

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CAD

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