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CYPT1545AV18-250GCMB - Infineon Technologies AG-CYPT1545AV18-250GCMB SRAM Chip SRAM Chip Sync Dual 1.8V 72M-bit 2M x 36 10ns 165-Pin CCGA Tray

CYPT1545AV18-250GCMB

Unknown
Infineon Technologies

SRAM CHIP SYNC DUAL 1.8V 72M-BIT 2M X 36 10NS 165-PIN CCGA TRAY

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CYPT1545AV18-250GCMB - Infineon Technologies AG-CYPT1545AV18-250GCMB SRAM Chip SRAM Chip Sync Dual 1.8V 72M-bit 2M x 36 10ns 165-Pin CCGA Tray

CYPT1545AV18-250GCMB

Unknown
Infineon Technologies

SRAM CHIP SYNC DUAL 1.8V 72M-BIT 2M X 36 10NS 165-PIN CCGA TRAY

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationCYPT1545AV18-250GCMB
Clock Frequency250 MHz
Memory FormatSRAM
Memory InterfaceParallel
Memory Organization [custom]36
Memory Organization [custom]2
Memory Size72 Gbit
Memory TypeVolatile
Mounting TypeThrough Hole
Operating Temperature [Max]125 °C
Operating Temperature [Min]-55 °C
Package / Case165-BFCPGA
Supplier Device Package165-CCGA (21x25)
TechnologySRAM - Synchronous, QDR II+
Voltage - Supply [Max]1.9 V
Voltage - Supply [Min]1.7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTray 5$ 6516.06

Description

General part information

CYPT1545 Series

Infineon’s 72Mb Quad Data Rate (QDR®)-II+, CYRS154x series, are high performance, synchronous pipelined SRAMs designed with Infineon’s RADSTOP™ technology. The 72Mb QDR®-II+ memories are available in x18/x36 and two-word/four-word data bus configurations, and provides low latency and random memory access capability for high speed cache applications. Infineon’s radiation hardened memories are QML-V certified, meeting the reliability and lifecycle demands of extreme environments. Our RADSTOPTMmemory solutions enhance overall system computing limits while providing Size, Weight, and Power (SWaP) benefits and greater design flexibility. Infineon’s state-of-the art RADSTOP™ technology is radiation hardened through proprietary design and process hardening techniques.

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Technical documentation and resources

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