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YQ5RSM10SDTFTL1

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Rohm Semiconductor

TRENCH MOS STRUCTURE, 100V, 5A, TO-277GE, HIGHLY EFFICIENT SBD FOR AUTOMOTIVE

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Product dimension image

YQ5RSM10SDTFTL1

Active
Rohm Semiconductor

TRENCH MOS STRUCTURE, 100V, 5A, TO-277GE, HIGHLY EFFICIENT SBD FOR AUTOMOTIVE

Find alt

Description

General part information

YQ5RSM10SDTF Series

The YQ5RSM10SDTF is a highly efficient Schottky Barrier Diode that is designed improving the tradeoff between low VFand low IR. While its low VFit achieves stable operation at high temperatures. Ideal for switching power supplies, freewheel diodes, and reverse polarity protection applications.

Technical Specifications

Parameters and characteristics for this part

SpecificationYQ5RSM10SDTFTL1
Current - Average Rectified (Io)5 A
Current - Reverse Leakage25 µA
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction175 °C
Package / CaseTO-277, 3-PowerDFN
Package NameTO-277A
QualificationAEC-Q101
Speed - Fast Recovery (Maximum)500 ns
Speed - Fast Recovery (Minimum)200 mA
TechnologySchottky
Voltage - DC Reverse (Vr) (Max)100 V
Voltage - Forward (Vf) (Max)770 mV

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

PCB Layout Thermal Design Guide
Part Explanation
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
YQ5RSM10SDTF Data Sheet
Absolute Maximum Rating and Electrical Characteristics of Diodes
Impedance Characteristics of Bypass Capacitor
Compliance of the RoHS directive
Diode Types and Applications
What is a Thermal Model? (Diode)
How to Select Rectifier Diodes
Power Loss and Thermal Design of Diodes
Method for Monitoring Switching Waveform
About Flammability of Materials
Notes for Temperature Measurement Using Thermocouples
Two-Resistor Model for Thermal Simulation
Judgment Criteria of Thermal Evaluation
Basics of Thermal Resistance and Heat Dissipation
How to Select Reverse Current Protection Diodes for LDO Regulators
Precautions When Measuring the Rear of the Package with a Thermocouple
Moisture Sensitivity Level - Diodes
What Is Thermal Design
How to Use LTspice® Models: Tips for Improving Convergence
How to Use LTspice® Models
ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment
Anti-Whisker formation - Diodes
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Diode Selection Method for Asynchronous Converter
List of Diode Package Thermal Resistance
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Measurement Method and Usage of Thermal Resistance RthJC
Importance of Probe Calibration When Measuring Power: Deskew
About Export Regulations
How to Use the Thermal Resistance and Thermal Characteristics Parameters
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Notes for Calculating Power Consumption:Static Operation
Notes for Temperature Measurement Using Forward Voltage of PN Junction
TO-277GE Dimensions